Integrating chip-level microfluidics cooling into system level design of digital circuits

Gy Bognár, G. Takács, L. Pohl, L. Jani, A. Timár, P. Horváth, M. Németh, A. Poppe, P. G. Szabó

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

In this paper, a novel tool and a methodology are introduced to create a thermally driven digital cell placement capability that considers the cooling capability of the integrated microscale heatsink structures. Normally, the realization of this kind of placement would require time-consuming computation fluid dynamics (CFD) simulations. With the presented solution, the CFD tool can be replaced by a thermal simulator, which incorporates analytical fluid dynamics compact models. By this approach, the determination of the precise local heat transfer coefficient(s) (thus cooling efficiency) can be realized. In addition, the temperature distribution along the microchannels can also be obtained depending on the channel geometries, the thermal properties of the fluid and the wall temperature(s). While this model is integrated into the thermal simulator, it is still needed to be connected to commercial digital IC design tools to unleash its full potential. Therefore, the interfacing tool is also developed that launches either the thermal, the electrical, or logical simulators and placement programs by using the outputs (results) of the other programs as the inputs.

Original languageEnglish
Title of host publication33rd Annual Semiconductor Thermal Measurement and Management Symposium, SEMI-THERM 2017 - Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages77-87
Number of pages11
ISBN (Electronic)9781538615317
DOIs
Publication statusPublished - Apr 11 2017
Event33rd Annual Semiconductor Thermal Measurement and Management Symposium, SEMI-THERM 2017 - San Jose, United States
Duration: Mar 13 2017Mar 17 2017

Other

Other33rd Annual Semiconductor Thermal Measurement and Management Symposium, SEMI-THERM 2017
CountryUnited States
CitySan Jose
Period3/13/173/17/17

Keywords

  • Cell-thermal co-simulation
  • Integrated microcooler
  • Logi-thermal simulation
  • Microchannel heat sink
  • Thermal modelling

ASJC Scopus subject areas

  • Instrumentation
  • Electrical and Electronic Engineering

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  • Cite this

    Bognár, G., Takács, G., Pohl, L., Jani, L., Timár, A., Horváth, P., Németh, M., Poppe, A., & Szabó, P. G. (2017). Integrating chip-level microfluidics cooling into system level design of digital circuits. In 33rd Annual Semiconductor Thermal Measurement and Management Symposium, SEMI-THERM 2017 - Proceedings (pp. 77-87). [7896912] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/SEMI-THERM.2017.7896912