Integrating advanced interconnect technologies in a high power lighting application: First steps

Sander Noijen, Sebastian Fritzsche, Andreas Steffen Klein, Andras Poppe, Gerard Kums, Olaf Van Der Sluis

Research output: Contribution to conferencePaper

1 Citation (Scopus)

Abstract

This paper reports on first results towards the development of a high power lighting demonstrator of the FP7 Nanotherm project. The demonstrator aims to show an optimized ROHS compliant interconnect solution. Hereto sintered materials are considered as alternative interconnect materials. Additionally, a heatspreader concept is evaluated as alternative for state-of-the-art IMS boards. This paper shows preliminary results for: -Transient thermal measurements of the reference system. -First trials of sintered past and adhesive used to mount LEDs on DCB substrates. -Thermal finite element simulations of the heatspreader concept compared to the IMS solution.

Original languageEnglish
Pages276-280
Number of pages5
DOIs
Publication statusPublished - 2013
Event19th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2013 - Berlin, Germany
Duration: Sep 25 2013Sep 27 2013

Other

Other19th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2013
CountryGermany
CityBerlin
Period9/25/139/27/13

ASJC Scopus subject areas

  • Hardware and Architecture

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  • Cite this

    Noijen, S., Fritzsche, S., Klein, A. S., Poppe, A., Kums, G., & Van Der Sluis, O. (2013). Integrating advanced interconnect technologies in a high power lighting application: First steps. 276-280. Paper presented at 19th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2013, Berlin, Germany. https://doi.org/10.1109/THERMINIC.2013.6675209