In vivo measurements with robust silicon-based multielectrode arrays with extreme shaft lengths

Gergely Marton, Zoltan Fekete, Richard Fiath, Peter Baracskay, I. Ulbert, G. Juhász, G. Battistig, Anita Pongracz

Research output: Contribution to journalArticle

8 Citations (Scopus)

Abstract

In this paper, manufacturing and in vivo testing of extreme-long Si-based neural microelectrode arrays are presented. Probes with different shaft lengths (15-70 mm) are formed by deep reactive ion etching and have been equipped with platinum electrodes of various configurations. In vivo measurements on rats indicate good mechanical stability, robust implantation, and targeting capability. High-quality signals have been recorded from different locations of the cerebrum of the rodents. The accompanied tissue damage is characterized by histology.

Original languageEnglish
Article number6509429
Pages (from-to)3263-3269
Number of pages7
JournalIEEE Sensors Journal
Volume13
Issue number9
DOIs
Publication statusPublished - 2013

Fingerprint

cerebrum
rodents
Histology
histology
Mechanical stability
Microelectrodes
Reactive ion etching
rats
Rats
Platinum
implantation
platinum
manufacturing
etching
Tissue
damage
Silicon
Electrodes
electrodes
probes

Keywords

  • deep-brain electrode
  • Neural microelectrode array
  • silicon-based microelectromechanical system
  • spike sorting

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Instrumentation

Cite this

In vivo measurements with robust silicon-based multielectrode arrays with extreme shaft lengths. / Marton, Gergely; Fekete, Zoltan; Fiath, Richard; Baracskay, Peter; Ulbert, I.; Juhász, G.; Battistig, G.; Pongracz, Anita.

In: IEEE Sensors Journal, Vol. 13, No. 9, 6509429, 2013, p. 3263-3269.

Research output: Contribution to journalArticle

Marton, Gergely ; Fekete, Zoltan ; Fiath, Richard ; Baracskay, Peter ; Ulbert, I. ; Juhász, G. ; Battistig, G. ; Pongracz, Anita. / In vivo measurements with robust silicon-based multielectrode arrays with extreme shaft lengths. In: IEEE Sensors Journal. 2013 ; Vol. 13, No. 9. pp. 3263-3269.
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