In-situ transient testing of thermal interface sheets and metal core boards in power switch assemblies

Gabor Farkas, Juergen Zettner, Zoltan Sarkany, M. Rencz

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

In power switch assemblies the heat is removed through laminate stacks containing thermal interface materials (TIM). Some information on a TIM layer quality can be obtained by dedicated thermal conductivity testers, but the in-situ behavior of a TIM in the assembly may significantly differ. Thermal transient testing yields partial thermal resistances of these layers in the stack and can provide temperature data on surfaces not accessible for direct measurements. The paper demonstrates simulation experiments on the feasibility of recognizing internal layers, and actual measurements on the change of TIMs in real power assemblies at priming (first powering event), run-in (early powering cycles) and curing at high temperature.

Original languageEnglish
Title of host publicationTHERMINIC 2017 - 23rd International Workshop on Thermal Investigations of ICs and Systems
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1-6
Number of pages6
Volume2017-January
ISBN (Electronic)9781538619285
DOIs
Publication statusPublished - Dec 21 2017
Event23rd International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2017 - Amsterdam, Netherlands
Duration: Sep 27 2017Sep 29 2017

Other

Other23rd International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2017
CountryNetherlands
CityAmsterdam
Period9/27/179/29/17

Fingerprint

Switch
Metals
Switches
Testing
Internal Layers
Thermal Resistance
Curing
Laminates
Thermal Conductivity
Simulation Experiment
Heat resistance
Heat
Thermal conductivity
Partial
Cycle
Hot Temperature
Temperature
Demonstrate
Experiments

ASJC Scopus subject areas

  • Safety, Risk, Reliability and Quality
  • Modelling and Simulation
  • Electrical and Electronic Engineering

Cite this

Farkas, G., Zettner, J., Sarkany, Z., & Rencz, M. (2017). In-situ transient testing of thermal interface sheets and metal core boards in power switch assemblies. In THERMINIC 2017 - 23rd International Workshop on Thermal Investigations of ICs and Systems (Vol. 2017-January, pp. 1-6). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/THERMINIC.2017.8233799

In-situ transient testing of thermal interface sheets and metal core boards in power switch assemblies. / Farkas, Gabor; Zettner, Juergen; Sarkany, Zoltan; Rencz, M.

THERMINIC 2017 - 23rd International Workshop on Thermal Investigations of ICs and Systems. Vol. 2017-January Institute of Electrical and Electronics Engineers Inc., 2017. p. 1-6.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Farkas, G, Zettner, J, Sarkany, Z & Rencz, M 2017, In-situ transient testing of thermal interface sheets and metal core boards in power switch assemblies. in THERMINIC 2017 - 23rd International Workshop on Thermal Investigations of ICs and Systems. vol. 2017-January, Institute of Electrical and Electronics Engineers Inc., pp. 1-6, 23rd International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2017, Amsterdam, Netherlands, 9/27/17. https://doi.org/10.1109/THERMINIC.2017.8233799
Farkas G, Zettner J, Sarkany Z, Rencz M. In-situ transient testing of thermal interface sheets and metal core boards in power switch assemblies. In THERMINIC 2017 - 23rd International Workshop on Thermal Investigations of ICs and Systems. Vol. 2017-January. Institute of Electrical and Electronics Engineers Inc. 2017. p. 1-6 https://doi.org/10.1109/THERMINIC.2017.8233799
Farkas, Gabor ; Zettner, Juergen ; Sarkany, Zoltan ; Rencz, M. / In-situ transient testing of thermal interface sheets and metal core boards in power switch assemblies. THERMINIC 2017 - 23rd International Workshop on Thermal Investigations of ICs and Systems. Vol. 2017-January Institute of Electrical and Electronics Engineers Inc., 2017. pp. 1-6
@inproceedings{10d92b898386439a84eaaaed7bc96923,
title = "In-situ transient testing of thermal interface sheets and metal core boards in power switch assemblies",
abstract = "In power switch assemblies the heat is removed through laminate stacks containing thermal interface materials (TIM). Some information on a TIM layer quality can be obtained by dedicated thermal conductivity testers, but the in-situ behavior of a TIM in the assembly may significantly differ. Thermal transient testing yields partial thermal resistances of these layers in the stack and can provide temperature data on surfaces not accessible for direct measurements. The paper demonstrates simulation experiments on the feasibility of recognizing internal layers, and actual measurements on the change of TIMs in real power assemblies at priming (first powering event), run-in (early powering cycles) and curing at high temperature.",
author = "Gabor Farkas and Juergen Zettner and Zoltan Sarkany and M. Rencz",
year = "2017",
month = "12",
day = "21",
doi = "10.1109/THERMINIC.2017.8233799",
language = "English",
volume = "2017-January",
pages = "1--6",
booktitle = "THERMINIC 2017 - 23rd International Workshop on Thermal Investigations of ICs and Systems",
publisher = "Institute of Electrical and Electronics Engineers Inc.",

}

TY - GEN

T1 - In-situ transient testing of thermal interface sheets and metal core boards in power switch assemblies

AU - Farkas, Gabor

AU - Zettner, Juergen

AU - Sarkany, Zoltan

AU - Rencz, M.

PY - 2017/12/21

Y1 - 2017/12/21

N2 - In power switch assemblies the heat is removed through laminate stacks containing thermal interface materials (TIM). Some information on a TIM layer quality can be obtained by dedicated thermal conductivity testers, but the in-situ behavior of a TIM in the assembly may significantly differ. Thermal transient testing yields partial thermal resistances of these layers in the stack and can provide temperature data on surfaces not accessible for direct measurements. The paper demonstrates simulation experiments on the feasibility of recognizing internal layers, and actual measurements on the change of TIMs in real power assemblies at priming (first powering event), run-in (early powering cycles) and curing at high temperature.

AB - In power switch assemblies the heat is removed through laminate stacks containing thermal interface materials (TIM). Some information on a TIM layer quality can be obtained by dedicated thermal conductivity testers, but the in-situ behavior of a TIM in the assembly may significantly differ. Thermal transient testing yields partial thermal resistances of these layers in the stack and can provide temperature data on surfaces not accessible for direct measurements. The paper demonstrates simulation experiments on the feasibility of recognizing internal layers, and actual measurements on the change of TIMs in real power assemblies at priming (first powering event), run-in (early powering cycles) and curing at high temperature.

UR - http://www.scopus.com/inward/record.url?scp=85045857180&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85045857180&partnerID=8YFLogxK

U2 - 10.1109/THERMINIC.2017.8233799

DO - 10.1109/THERMINIC.2017.8233799

M3 - Conference contribution

VL - 2017-January

SP - 1

EP - 6

BT - THERMINIC 2017 - 23rd International Workshop on Thermal Investigations of ICs and Systems

PB - Institute of Electrical and Electronics Engineers Inc.

ER -