In situ thermal reliability testing methodology for novel thermal interface materials

Gusztáv Hantos, László Juhász, Márta Rencz

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)

Abstract

A novel in situ reliability testing method and the prototype of an industrially applicable automated system (the Viking Reliability Tester) was described in this paper for the characterization of TIM aging effects in semiconductor devices. The introduced reliability testing hardware-software framework utilizes Mentor Graphics T3Ster thermal transient tester to analyze the stress-induced deviations in the heat flow path from the pre-stress reference results. Measurement results collected during the active or passive cycling of the DUTs at regular intervals serve as basis for the comparison. The details of the degradation process can be used as input for life-time prediction and for physics of failure modeling. The practical application of the concept was demonstrated on power LEDs, including details about pre-stress measurement results and aging test-plan.

Original languageEnglish
Title of host publicationTHERMINIC 2014 - 20th International Workshop on Thermal Investigations of ICs and Systems, Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781479954155
DOIs
Publication statusPublished - Dec 2 2014
Event20th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2014 - Greenwich, London, United Kingdom
Duration: Sep 24 2014Sep 26 2014

Publication series

NameTHERMINIC 2014 - 20th International Workshop on Thermal Investigations of ICs and Systems, Proceedings

Other

Other20th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2014
CountryUnited Kingdom
CityGreenwich, London
Period9/24/149/26/14

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering

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    Hantos, G., Juhász, L., & Rencz, M. (2014). In situ thermal reliability testing methodology for novel thermal interface materials. In THERMINIC 2014 - 20th International Workshop on Thermal Investigations of ICs and Systems, Proceedings [6972532] (THERMINIC 2014 - 20th International Workshop on Thermal Investigations of ICs and Systems, Proceedings). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/THERMINIC.2014.6972532