High-aspect-ratio metal microchannel plates for microelectronic cooling applications

W. Yu, M. P Y Desmulliez, A. Drufke, M. Leonard, R. S. Dhariwal, D. Flynn, G. Bognár, A. Poppe, G. Horvath, Z. Kohari, M. Rencz

Research output: Contribution to journalArticle

29 Citations (Scopus)

Abstract

A new manufacturing process and the characterization of high-aspect-ratio metal microchannel plates for microelectronic cooling applications are reported in this article. A nickel-based microchannel cooling plate, with channels of width 20 μm and aspect ratio up to 3.6:1, has been successfully fabricated using a modified UV-LIGA process. Similar metal microstructures, based on electroplated copper, have also been obtained with a width of 15 μm and an aspect ratio of up to 5:1. In both cases, an over-plate technology was used to electroform the metallic microchannel plates in a single manufacturing step. Hydrodynamic and cooling characteristics of the microchannel plates such as flow rate and heat resistance have been measured. A heat transfer coefficient of 511 W m-2 K-1 for a flow rate of 120 l h-1 has been obtained for the 20 μm wide nickel-based microchannel.

Original languageEnglish
Article number025004
JournalJournal of Micromechanics and Microengineering
Volume20
Issue number2
DOIs
Publication statusPublished - 2010

Fingerprint

Microchannels
Microelectronics
Aspect ratio
Metals
Cooling
Nickel
Flow rate
Heat resistance
Heat transfer coefficients
Copper
Hydrodynamics
Microstructure

ASJC Scopus subject areas

  • Mechanical Engineering
  • Electrical and Electronic Engineering
  • Mechanics of Materials
  • Electronic, Optical and Magnetic Materials

Cite this

High-aspect-ratio metal microchannel plates for microelectronic cooling applications. / Yu, W.; Desmulliez, M. P Y; Drufke, A.; Leonard, M.; Dhariwal, R. S.; Flynn, D.; Bognár, G.; Poppe, A.; Horvath, G.; Kohari, Z.; Rencz, M.

In: Journal of Micromechanics and Microengineering, Vol. 20, No. 2, 025004, 2010.

Research output: Contribution to journalArticle

Yu, W, Desmulliez, MPY, Drufke, A, Leonard, M, Dhariwal, RS, Flynn, D, Bognár, G, Poppe, A, Horvath, G, Kohari, Z & Rencz, M 2010, 'High-aspect-ratio metal microchannel plates for microelectronic cooling applications', Journal of Micromechanics and Microengineering, vol. 20, no. 2, 025004. https://doi.org/10.1088/0960-1317/20/2/025004
Yu, W. ; Desmulliez, M. P Y ; Drufke, A. ; Leonard, M. ; Dhariwal, R. S. ; Flynn, D. ; Bognár, G. ; Poppe, A. ; Horvath, G. ; Kohari, Z. ; Rencz, M. / High-aspect-ratio metal microchannel plates for microelectronic cooling applications. In: Journal of Micromechanics and Microengineering. 2010 ; Vol. 20, No. 2.
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AU - Flynn, D.

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