High-aspect-ratio metal microchannel plates for microelectronic cooling applications

W. Yu, M. P.Y. Desmulliez, A. Drufke, M. Leonard, R. S. Dhariwal, D. Flynn, G. Bognár, A. Poppe, G. Horvath, Z. Kohari, M. Rencz

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A new manufacturing process and the characterization of high-aspect-ratio metal microchannel plates for microelectronic cooling applications are reported in this article. A nickel-based microchannel cooling plate, with channels of width 20 μm and aspect ratio up to 3.6:1, has been successfully fabricated using a modified UV-LIGA process. Similar metal microstructures, based on electroplated copper, have also been obtained with a width of 15 μm and an aspect ratio of up to 5:1. In both cases, an over-plate technology was used to electroform the metallic microchannel plates in a single manufacturing step. Hydrodynamic and cooling characteristics of the microchannel plates such as flow rate and heat resistance have been measured. A heat transfer coefficient of 511 W m-2 K-1 for a flow rate of 120 l h-1 has been obtained for the 20 μm wide nickel-based microchannel.

Original languageEnglish
Article number025004
JournalJournal of Micromechanics and Microengineering
Issue number2
Publication statusPublished - Feb 5 2010


ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Mechanics of Materials
  • Mechanical Engineering
  • Electrical and Electronic Engineering

Cite this

Yu, W., Desmulliez, M. P. Y., Drufke, A., Leonard, M., Dhariwal, R. S., Flynn, D., Bognár, G., Poppe, A., Horvath, G., Kohari, Z., & Rencz, M. (2010). High-aspect-ratio metal microchannel plates for microelectronic cooling applications. Journal of Micromechanics and Microengineering, 20(2), [025004]. https://doi.org/10.1088/0960-1317/20/2/025004