From MEMS to the global simulation of SoCs

Research output: Contribution to journalArticle


This paper is dealing with design, simulation and test of microsystems (microelectromechanical systems, MEMS). Both existing tools and open research areas are addressed. All through the paper, similarities between the present development of MEMS and the development of microelectronics decades ago are pointed out, including the migration from point tools to Computer-Aided Design (CAD) frameworks, testing, foundries/fabless business or Intellectual Property (IP) issues. Specific aspects such as thermal simulation of microstructures and thermomechanical design at the package level. The conclusion is depicting a possible global simulation scheme integrating the needs of Systems on Chip (SoCs) multilanguage simulation together with the needs of MEMS multipurpose simulation.

Original languageEnglish
Pages (from-to)9-20
Number of pages12
JournalProceedings of SPIE - The International Society for Optical Engineering
Publication statusPublished - Jan 1 2000



  • CAD
  • Manufacturing
  • Microelectromechanical systems
  • Microsystems
  • Packaging
  • Testing

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

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