Frits in thick film superconductors: A special approach for improving superconducting and adhesion properties

G. Harsányi, Yanqing Liu, W. Kinzy Jones

Research output: Contribution to journalArticle

Abstract

Specially formulated frit materials have been applied in thick film superconductors similar to the standard thick film materials in order to achieve processing parameters closely compatible with conventional thick film technology and alumina substrates. The applied frits have improved the adhesion and superconductor properties at the same time due to a superconductor bridge formation between the grains. Both YBCO and BSCCO systems have been analyzed. The results are promising.

Original languageEnglish
Pages (from-to)22-25
Number of pages4
JournalMicroelectronics International
Volume15
Issue number3
Publication statusPublished - Sep 1998

Fingerprint

Thick films
Superconducting materials
thick films
adhesion
Adhesion
frit
Aluminum Oxide
Alumina
aluminum oxides
Substrates
Processing

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Frits in thick film superconductors : A special approach for improving superconducting and adhesion properties. / Harsányi, G.; Liu, Yanqing; Jones, W. Kinzy.

In: Microelectronics International, Vol. 15, No. 3, 09.1998, p. 22-25.

Research output: Contribution to journalArticle

@article{564619adaed548ab91596c26c3610a8a,
title = "Frits in thick film superconductors: A special approach for improving superconducting and adhesion properties",
abstract = "Specially formulated frit materials have been applied in thick film superconductors similar to the standard thick film materials in order to achieve processing parameters closely compatible with conventional thick film technology and alumina substrates. The applied frits have improved the adhesion and superconductor properties at the same time due to a superconductor bridge formation between the grains. Both YBCO and BSCCO systems have been analyzed. The results are promising.",
author = "G. Hars{\'a}nyi and Yanqing Liu and Jones, {W. Kinzy}",
year = "1998",
month = "9",
language = "English",
volume = "15",
pages = "22--25",
journal = "Microelectronics International",
issn = "1356-5362",
publisher = "Emerald Group Publishing Ltd.",
number = "3",

}

TY - JOUR

T1 - Frits in thick film superconductors

T2 - A special approach for improving superconducting and adhesion properties

AU - Harsányi, G.

AU - Liu, Yanqing

AU - Jones, W. Kinzy

PY - 1998/9

Y1 - 1998/9

N2 - Specially formulated frit materials have been applied in thick film superconductors similar to the standard thick film materials in order to achieve processing parameters closely compatible with conventional thick film technology and alumina substrates. The applied frits have improved the adhesion and superconductor properties at the same time due to a superconductor bridge formation between the grains. Both YBCO and BSCCO systems have been analyzed. The results are promising.

AB - Specially formulated frit materials have been applied in thick film superconductors similar to the standard thick film materials in order to achieve processing parameters closely compatible with conventional thick film technology and alumina substrates. The applied frits have improved the adhesion and superconductor properties at the same time due to a superconductor bridge formation between the grains. Both YBCO and BSCCO systems have been analyzed. The results are promising.

UR - http://www.scopus.com/inward/record.url?scp=13144282767&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=13144282767&partnerID=8YFLogxK

M3 - Article

AN - SCOPUS:13144282767

VL - 15

SP - 22

EP - 25

JO - Microelectronics International

JF - Microelectronics International

SN - 1356-5362

IS - 3

ER -