FPGA power model for minimizing the thermal dissipation

Ábel Vámos, Márta Rencz

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

In the field of application specific ICs the FPGA became more and more important. When such a system is under construction the designer has very few information about the final dissipation of the circuit. The solution should be a power model which can give prediction about the final dissipation of the particular functionality of the FPGA device. In this paper methods are described for power modeling and power-aware designing.

Original languageEnglish
Title of host publication14th International Workshop on Thermal Investigation of ICs and Systems, THERMINIC 2008
Pages148-151
Number of pages4
DOIs
Publication statusPublished - Dec 22 2008
Event14th International Workshop on THERMal INvestigation of ICs and Systems, THERMINIC 2008 - Rome, Italy
Duration: Sep 24 2008Sep 26 2008

Publication series

Name14th International Workshop on THERMal INvestigation of ICs and Systems, THERMINIC 2008

Other

Other14th International Workshop on THERMal INvestigation of ICs and Systems, THERMINIC 2008
CountryItaly
CityRome
Period9/24/089/26/08

ASJC Scopus subject areas

  • Hardware and Architecture
  • Control and Systems Engineering
  • Electrical and Electronic Engineering

Fingerprint Dive into the research topics of 'FPGA power model for minimizing the thermal dissipation'. Together they form a unique fingerprint.

  • Cite this

    Vámos, Á., & Rencz, M. (2008). FPGA power model for minimizing the thermal dissipation. In 14th International Workshop on Thermal Investigation of ICs and Systems, THERMINIC 2008 (pp. 148-151). [4669897] (14th International Workshop on THERMal INvestigation of ICs and Systems, THERMINIC 2008). https://doi.org/10.1109/THERMINIC.2008.4669897