Formation of microstructural defects in electrodeposited Co/Cu multilayers

D. Rafaja, C. Schimpf, V. Klemm, G. Schreiber, I. Bakonyi, L. Péter

Research output: Contribution to journalArticle

28 Citations (Scopus)

Abstract

The effect of the thickness of the copper layers on the microstructure and magnetoresistance of electrodeposited Co/Cu multilayers was investigated by using the combination of wide-angle and small-angle X-ray scattering, transmission electron microscopy with high resolution and magnetoresistance measurement. The main tasks of the study were the classification of the microstructural defects, which form during the electrodeposition of Co/Cu multilayers, the description of mechanisms that are involved in the formation of these defects and the correlation of the kind and density of the microstructural defects as obtained using the microstructural analysis with the magnitude of the magnetoresistance effect, which was concluded from the magnetoresistance curves.

Original languageEnglish
Pages (from-to)3211-3222
Number of pages12
JournalActa Materialia
Volume57
Issue number11
DOIs
Publication statusPublished - Jun 2009

Fingerprint

Magnetoresistance
Multilayers
Defects
X ray scattering
Electrodeposition
Copper
Transmission electron microscopy
Microstructure

Keywords

  • Co/Cu multilayers
  • Electrodeposition
  • Giant magnetoresistance
  • High-resolution electron microscopy
  • X-ray scattering

ASJC Scopus subject areas

  • Ceramics and Composites
  • Metals and Alloys
  • Polymers and Plastics
  • Electronic, Optical and Magnetic Materials

Cite this

Formation of microstructural defects in electrodeposited Co/Cu multilayers. / Rafaja, D.; Schimpf, C.; Klemm, V.; Schreiber, G.; Bakonyi, I.; Péter, L.

In: Acta Materialia, Vol. 57, No. 11, 06.2009, p. 3211-3222.

Research output: Contribution to journalArticle

Rafaja, D. ; Schimpf, C. ; Klemm, V. ; Schreiber, G. ; Bakonyi, I. ; Péter, L. / Formation of microstructural defects in electrodeposited Co/Cu multilayers. In: Acta Materialia. 2009 ; Vol. 57, No. 11. pp. 3211-3222.
@article{c1c1669342964442904e274192586ff8,
title = "Formation of microstructural defects in electrodeposited Co/Cu multilayers",
abstract = "The effect of the thickness of the copper layers on the microstructure and magnetoresistance of electrodeposited Co/Cu multilayers was investigated by using the combination of wide-angle and small-angle X-ray scattering, transmission electron microscopy with high resolution and magnetoresistance measurement. The main tasks of the study were the classification of the microstructural defects, which form during the electrodeposition of Co/Cu multilayers, the description of mechanisms that are involved in the formation of these defects and the correlation of the kind and density of the microstructural defects as obtained using the microstructural analysis with the magnitude of the magnetoresistance effect, which was concluded from the magnetoresistance curves.",
keywords = "Co/Cu multilayers, Electrodeposition, Giant magnetoresistance, High-resolution electron microscopy, X-ray scattering",
author = "D. Rafaja and C. Schimpf and V. Klemm and G. Schreiber and I. Bakonyi and L. P{\'e}ter",
year = "2009",
month = "6",
doi = "10.1016/j.actamat.2009.03.029",
language = "English",
volume = "57",
pages = "3211--3222",
journal = "Acta Materialia",
issn = "1359-6454",
publisher = "Elsevier Limited",
number = "11",

}

TY - JOUR

T1 - Formation of microstructural defects in electrodeposited Co/Cu multilayers

AU - Rafaja, D.

AU - Schimpf, C.

AU - Klemm, V.

AU - Schreiber, G.

AU - Bakonyi, I.

AU - Péter, L.

PY - 2009/6

Y1 - 2009/6

N2 - The effect of the thickness of the copper layers on the microstructure and magnetoresistance of electrodeposited Co/Cu multilayers was investigated by using the combination of wide-angle and small-angle X-ray scattering, transmission electron microscopy with high resolution and magnetoresistance measurement. The main tasks of the study were the classification of the microstructural defects, which form during the electrodeposition of Co/Cu multilayers, the description of mechanisms that are involved in the formation of these defects and the correlation of the kind and density of the microstructural defects as obtained using the microstructural analysis with the magnitude of the magnetoresistance effect, which was concluded from the magnetoresistance curves.

AB - The effect of the thickness of the copper layers on the microstructure and magnetoresistance of electrodeposited Co/Cu multilayers was investigated by using the combination of wide-angle and small-angle X-ray scattering, transmission electron microscopy with high resolution and magnetoresistance measurement. The main tasks of the study were the classification of the microstructural defects, which form during the electrodeposition of Co/Cu multilayers, the description of mechanisms that are involved in the formation of these defects and the correlation of the kind and density of the microstructural defects as obtained using the microstructural analysis with the magnitude of the magnetoresistance effect, which was concluded from the magnetoresistance curves.

KW - Co/Cu multilayers

KW - Electrodeposition

KW - Giant magnetoresistance

KW - High-resolution electron microscopy

KW - X-ray scattering

UR - http://www.scopus.com/inward/record.url?scp=65649141644&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=65649141644&partnerID=8YFLogxK

U2 - 10.1016/j.actamat.2009.03.029

DO - 10.1016/j.actamat.2009.03.029

M3 - Article

AN - SCOPUS:65649141644

VL - 57

SP - 3211

EP - 3222

JO - Acta Materialia

JF - Acta Materialia

SN - 1359-6454

IS - 11

ER -