Foreword: Contributions from thermal investigations of ICs and systems (THERMINIC)

Clemens J.M. Lasance, Vladimir Szekely

Research output: Contribution to journalEditorial

Original languageEnglish
Pages (from-to)79-80
Number of pages2
JournalIEEE Transactions on Components and Packaging Technologies
Volume27
Issue number1
DOIs
Publication statusPublished - Mar 1 2004

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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