Flexible packaging for tyre integrated shear force sensor

S. Kulinyi, R. Vegvari, A. Pongracz, A. Nagy, T. Karpati, M. Adam, G. Battistig, I. Bársony

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

Wireless Si 3D force sensor made by MEMS technology was integrated and tested on the sidewall of a tyre using flexible rubber repair patch (patent pending) in order to monitor the deformation of the rotating tyre in automotive applications. Finite element simulation was used to determine the optimal positioning of the sensor structure. Power supply and wireless communication is based on inductive coupling. Static characterization on a measurement pad and preliminary real life-testing has been carried out.

Original languageEnglish
Title of host publicationIEEE SENSORS 2012 - Proceedings
DOIs
Publication statusPublished - Dec 1 2012
Event11th IEEE SENSORS 2012 Conference - Taipei, Taiwan, Province of China
Duration: Oct 28 2012Oct 31 2012

Publication series

NameProceedings of IEEE Sensors

Other

Other11th IEEE SENSORS 2012 Conference
CountryTaiwan, Province of China
CityTaipei
Period10/28/1210/31/12

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Fingerprint Dive into the research topics of 'Flexible packaging for tyre integrated shear force sensor'. Together they form a unique fingerprint.

  • Cite this

    Kulinyi, S., Vegvari, R., Pongracz, A., Nagy, A., Karpati, T., Adam, M., Battistig, G., & Bársony, I. (2012). Flexible packaging for tyre integrated shear force sensor. In IEEE SENSORS 2012 - Proceedings [6411326] (Proceedings of IEEE Sensors). https://doi.org/10.1109/ICSENS.2012.6411326