Finite element modeling of channel sag in LTCC

Eszter Horvath, Gabor Henap, G. Harsányi

Research output: Contribution to journalArticle

5 Citations (Scopus)

Abstract

Purpose - In microfluidic channel fabrication in low temperature co-fired ceramics (LTCC), one of the biggest challenges is the elimination of channel deformation during lamination. The purpose of this paper is to describe the expected deformation of the substrate and the sacrificial layer (starch powder and 3D printed UV polymerized material) during the lamination process of microfluidic structure fabrication. Design/methodology/approach - Uniaxial compression and Jenike shear test were used to obtain the mechanical parameters of starch sacrificial volume material (SVM). To determine the stress-strain characteristics of LTCC a uniaxial compression experiment was conducted. The shape of the laminated LTCC containing embedded channel was modeled by finite element method using the mechanical parameters obtained by the measurements. Findings - It was found that the choice of SVM plays an important role in channel deformation. A design rule is given considering the channel width and the choice of SVM based on the simulation results. Originality/value - Until now the lamination step of LTCC technology was only optimized in an empirical way.

Original languageEnglish
Pages (from-to)145-152
Number of pages8
JournalMicroelectronics International
Volume29
Issue number3
DOIs
Publication statusPublished - 2012

Fingerprint

ceramics
laminates
Starch
Microfluidics
starches
Fabrication
Temperature
fabrication
Powders
elimination
finite element method
Finite element method
methodology
shear
Substrates
Experiments
simulation

Keywords

  • Ceramics
  • Channel deformation
  • Deformation
  • Finite element model
  • Lamination
  • Low temperature co-fired ceramics
  • Microfluidics

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Surfaces, Coatings and Films
  • Atomic and Molecular Physics, and Optics
  • Condensed Matter Physics

Cite this

Finite element modeling of channel sag in LTCC. / Horvath, Eszter; Henap, Gabor; Harsányi, G.

In: Microelectronics International, Vol. 29, No. 3, 2012, p. 145-152.

Research output: Contribution to journalArticle

Horvath, Eszter ; Henap, Gabor ; Harsányi, G. / Finite element modeling of channel sag in LTCC. In: Microelectronics International. 2012 ; Vol. 29, No. 3. pp. 145-152.
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