Fine structure of heat flow path in semiconductor devices: A measurement and identification method

Vladimir Székely, Tran Van Bien

Research output: Contribution to journalArticle

323 Citations (Scopus)

Abstract

A new method has been developed in order to identify the thermal environment of a semiconductor device chip. The identification algorithm operates on the thermal transient response of the device recorded during a one-shot pulse measurement. A deconvolution operation performed in the logarithmic time domain gives the "time-constant spectrum" of the chip-case-ambient thermal structure. A further transformation leads to the "structure-function" that is the cross-sectional area of the heat conducting materials vs thermal resistance (related to the heat source). The structure function has a good and quantitatively evaluable correspondence to the physical chip environment and heat conducting structure. Separating the different regions of the heat-flow path (corresponding to the chip, bond, header, case) as well as the detection of eventual heat-transport irregularities (mounting errors) is possible.

Original languageEnglish
Pages (from-to)1363-1368
Number of pages6
JournalSolid State Electronics
Volume31
Issue number9
DOIs
Publication statusPublished - Sep 1988

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ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Electrical and Electronic Engineering
  • Materials Chemistry

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