Fine structure of heat flow path in semiconductor devices

A measurement and identification method

V. Székely, Tran Van Bien

Research output: Contribution to journalArticle

321 Citations (Scopus)

Abstract

A new method has been developed in order to identify the thermal environment of a semiconductor device chip. The identification algorithm operates on the thermal transient response of the device recorded during a one-shot pulse measurement. A deconvolution operation performed in the logarithmic time domain gives the "time-constant spectrum" of the chip-case-ambient thermal structure. A further transformation leads to the "structure-function" that is the cross-sectional area of the heat conducting materials vs thermal resistance (related to the heat source). The structure function has a good and quantitatively evaluable correspondence to the physical chip environment and heat conducting structure. Separating the different regions of the heat-flow path (corresponding to the chip, bond, header, case) as well as the detection of eventual heat-transport irregularities (mounting errors) is possible.

Original languageEnglish
Pages (from-to)1363-1368
Number of pages6
JournalSolid-State Electronics
Volume31
Issue number9
DOIs
Publication statusPublished - 1988

Fingerprint

Semiconductor devices
semiconductor devices
heat transmission
fine structure
chips
Heat transfer
heat
headers
conduction
thermal environments
transient response
mounting
thermal resistance
heat sources
irregularities
time constant
shot
Deconvolution
Hot Temperature
Mountings

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics

Cite this

Fine structure of heat flow path in semiconductor devices : A measurement and identification method. / Székely, V.; Van Bien, Tran.

In: Solid-State Electronics, Vol. 31, No. 9, 1988, p. 1363-1368.

Research output: Contribution to journalArticle

@article{d33e4fe9f1194f00a31d77354d5da1ab,
title = "Fine structure of heat flow path in semiconductor devices: A measurement and identification method",
abstract = "A new method has been developed in order to identify the thermal environment of a semiconductor device chip. The identification algorithm operates on the thermal transient response of the device recorded during a one-shot pulse measurement. A deconvolution operation performed in the logarithmic time domain gives the {"}time-constant spectrum{"} of the chip-case-ambient thermal structure. A further transformation leads to the {"}structure-function{"} that is the cross-sectional area of the heat conducting materials vs thermal resistance (related to the heat source). The structure function has a good and quantitatively evaluable correspondence to the physical chip environment and heat conducting structure. Separating the different regions of the heat-flow path (corresponding to the chip, bond, header, case) as well as the detection of eventual heat-transport irregularities (mounting errors) is possible.",
author = "V. Sz{\'e}kely and {Van Bien}, Tran",
year = "1988",
doi = "10.1016/0038-1101(88)90099-8",
language = "English",
volume = "31",
pages = "1363--1368",
journal = "Solid-State Electronics",
issn = "0038-1101",
publisher = "Elsevier Limited",
number = "9",

}

TY - JOUR

T1 - Fine structure of heat flow path in semiconductor devices

T2 - A measurement and identification method

AU - Székely, V.

AU - Van Bien, Tran

PY - 1988

Y1 - 1988

N2 - A new method has been developed in order to identify the thermal environment of a semiconductor device chip. The identification algorithm operates on the thermal transient response of the device recorded during a one-shot pulse measurement. A deconvolution operation performed in the logarithmic time domain gives the "time-constant spectrum" of the chip-case-ambient thermal structure. A further transformation leads to the "structure-function" that is the cross-sectional area of the heat conducting materials vs thermal resistance (related to the heat source). The structure function has a good and quantitatively evaluable correspondence to the physical chip environment and heat conducting structure. Separating the different regions of the heat-flow path (corresponding to the chip, bond, header, case) as well as the detection of eventual heat-transport irregularities (mounting errors) is possible.

AB - A new method has been developed in order to identify the thermal environment of a semiconductor device chip. The identification algorithm operates on the thermal transient response of the device recorded during a one-shot pulse measurement. A deconvolution operation performed in the logarithmic time domain gives the "time-constant spectrum" of the chip-case-ambient thermal structure. A further transformation leads to the "structure-function" that is the cross-sectional area of the heat conducting materials vs thermal resistance (related to the heat source). The structure function has a good and quantitatively evaluable correspondence to the physical chip environment and heat conducting structure. Separating the different regions of the heat-flow path (corresponding to the chip, bond, header, case) as well as the detection of eventual heat-transport irregularities (mounting errors) is possible.

UR - http://www.scopus.com/inward/record.url?scp=0024069775&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0024069775&partnerID=8YFLogxK

U2 - 10.1016/0038-1101(88)90099-8

DO - 10.1016/0038-1101(88)90099-8

M3 - Article

VL - 31

SP - 1363

EP - 1368

JO - Solid-State Electronics

JF - Solid-State Electronics

SN - 0038-1101

IS - 9

ER -