Failure analysis methods in electronics assembly technology

Bálint Balogh, Péter Gordon, Robert Kovács, Csaba Nagynémedi, Peter János Szabó, Gábor Harsányi

Research output: Contribution to journalConference article

1 Citation (Scopus)


The aim of this paper is to describe a failure analysis methodology applicable to reveal the root causes of electronic assembly failures. The most relevant properties of the applied techniques, i.e. optical microscopy, X-ray microstructure analysis, SEM (scanning electron microscopy) combined with EDX (energy dispersive X-ray spectroscopy) analysis, are given. Three recent failure analysis case studies are also presented. In case of a burnt component the microwire and the leadframe formed AlCu intermetallic compound in the length of several millimeters. The low joint strength of gullwing leads were deduced back to paste printing and wetting problems. The fracture surface morphology of a joint broken on the field showed different structure from the ones broken at room temperature. It was revealed that SnPb solder fracture surface is different at room temperature and above 100°C.

Original languageEnglish
Pages (from-to)349-354
Number of pages6
JournalMaterials Science Forum
Publication statusPublished - Dec 1 2008
Event6th Hungarian Conference on Materials Science - Siofok, Hungary
Duration: Oct 14 2007Oct 16 2007



  • Failure analysis
  • Insufficient solder
  • Solder joint failures
  • Solder joint fracture
  • X-ray microstructure analysis

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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