Factors influencing the recrystallization of non-sag tungsten wires indicated by the out-diffusion of cobalt

L. Uray, A. Sulyok, P. Tekula-Buxbaum

Research output: Contribution to journalArticle

2 Citations (Scopus)

Abstract

In Al, K, Si doped (AKS) tungsten wires, the socalled recrystallization temperature, TSR, rises to a very high value due to the pinning effect of bubble rows against grain growth. However, TSR can also be influenced by several other factors, like: intermediate heat treatments during wire drawing, annealing the wire at different temperatures or times, or applying further strain e.g. by coiling or torsion. As a model material, AKS tungsten wire with an excess cobalt dope was investigated, in which the variations in the solute cobalt content were easily followed by measuring thermoelectric power. In this way e.g. diffusion governed processes, like segregation-desegregation, the rapid or slow out-diffusion of Co and the effect of different heat treatments on TSR can also be investigated.

Original languageEnglish
Pages (from-to)289-300
Number of pages12
JournalHigh Temperature Material Processes
Volume24
Issue number5
Publication statusPublished - 2005

Fingerprint

Tungsten
Cobalt
tungsten
cobalt
wire
Wire
Heat treatment
Wire drawing
heat treatment
Thermoelectric power
Grain growth
Torsional stress
Annealing
torsion
Temperature
solutes
bubbles
annealing
temperature

ASJC Scopus subject areas

  • Materials Science(all)

Cite this

Factors influencing the recrystallization of non-sag tungsten wires indicated by the out-diffusion of cobalt. / Uray, L.; Sulyok, A.; Tekula-Buxbaum, P.

In: High Temperature Material Processes, Vol. 24, No. 5, 2005, p. 289-300.

Research output: Contribution to journalArticle

@article{9384adef68414696913aa2f6d4f40db0,
title = "Factors influencing the recrystallization of non-sag tungsten wires indicated by the out-diffusion of cobalt",
abstract = "In Al, K, Si doped (AKS) tungsten wires, the socalled recrystallization temperature, TSR, rises to a very high value due to the pinning effect of bubble rows against grain growth. However, TSR can also be influenced by several other factors, like: intermediate heat treatments during wire drawing, annealing the wire at different temperatures or times, or applying further strain e.g. by coiling or torsion. As a model material, AKS tungsten wire with an excess cobalt dope was investigated, in which the variations in the solute cobalt content were easily followed by measuring thermoelectric power. In this way e.g. diffusion governed processes, like segregation-desegregation, the rapid or slow out-diffusion of Co and the effect of different heat treatments on TSR can also be investigated.",
author = "L. Uray and A. Sulyok and P. Tekula-Buxbaum",
year = "2005",
language = "English",
volume = "24",
pages = "289--300",
journal = "High Temperature Materials and Processes",
issn = "1093-3611",
publisher = "Begell House Inc.",
number = "5",

}

TY - JOUR

T1 - Factors influencing the recrystallization of non-sag tungsten wires indicated by the out-diffusion of cobalt

AU - Uray, L.

AU - Sulyok, A.

AU - Tekula-Buxbaum, P.

PY - 2005

Y1 - 2005

N2 - In Al, K, Si doped (AKS) tungsten wires, the socalled recrystallization temperature, TSR, rises to a very high value due to the pinning effect of bubble rows against grain growth. However, TSR can also be influenced by several other factors, like: intermediate heat treatments during wire drawing, annealing the wire at different temperatures or times, or applying further strain e.g. by coiling or torsion. As a model material, AKS tungsten wire with an excess cobalt dope was investigated, in which the variations in the solute cobalt content were easily followed by measuring thermoelectric power. In this way e.g. diffusion governed processes, like segregation-desegregation, the rapid or slow out-diffusion of Co and the effect of different heat treatments on TSR can also be investigated.

AB - In Al, K, Si doped (AKS) tungsten wires, the socalled recrystallization temperature, TSR, rises to a very high value due to the pinning effect of bubble rows against grain growth. However, TSR can also be influenced by several other factors, like: intermediate heat treatments during wire drawing, annealing the wire at different temperatures or times, or applying further strain e.g. by coiling or torsion. As a model material, AKS tungsten wire with an excess cobalt dope was investigated, in which the variations in the solute cobalt content were easily followed by measuring thermoelectric power. In this way e.g. diffusion governed processes, like segregation-desegregation, the rapid or slow out-diffusion of Co and the effect of different heat treatments on TSR can also be investigated.

UR - http://www.scopus.com/inward/record.url?scp=29544444163&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=29544444163&partnerID=8YFLogxK

M3 - Article

AN - SCOPUS:29544444163

VL - 24

SP - 289

EP - 300

JO - High Temperature Materials and Processes

JF - High Temperature Materials and Processes

SN - 1093-3611

IS - 5

ER -