Fabrication of cube-textured Ag-buffered Ni substrates by electro-epitaxial deposition

R. Goodall, J. C. Moore, B. Pécz, G. W. Grime, C. J. Salter, C. R M Grovenor

Research output: Contribution to journalArticle

6 Citations (Scopus)

Abstract

Cube-textured silver buffer layers have been fabricated using the easily scalable technique of electro-epitaxial deposition. Continuous 150 nm thick silver films with in-plane FWHM values of 8deg; have been epitaxially deposited directly onto cube-textured Ni, Ni-10 wt% Cr and NiFe substrates using no intermediate buffer layer and no post-deposition heat treatment. Studies of the thermal stability of the coatings show that the texture is stable up to 900 °C and that continuous films are retained up to 800 °C. We believe that electro-epitaxial deposition offers a promising method for the fabrication of low-cost, long length biaxially textured substrates for superconducting tape.

Original languageEnglish
Pages (from-to)124-129
Number of pages6
JournalSuperconductor Science and Technology
Volume14
Issue number3
DOIs
Publication statusPublished - Mar 2001

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electrodeposition
buffers
silver
Buffer layers
Silver
Fabrication
fabrication
Substrates
Superconducting tapes
tapes
heat treatment
thermal stability
textures
Full width at half maximum
coatings
Thermodynamic stability
Textures
Heat treatment
Coatings
Costs

ASJC Scopus subject areas

  • Physics and Astronomy (miscellaneous)
  • Condensed Matter Physics
  • Electronic, Optical and Magnetic Materials

Cite this

Fabrication of cube-textured Ag-buffered Ni substrates by electro-epitaxial deposition. / Goodall, R.; Moore, J. C.; Pécz, B.; Grime, G. W.; Salter, C. J.; Grovenor, C. R M.

In: Superconductor Science and Technology, Vol. 14, No. 3, 03.2001, p. 124-129.

Research output: Contribution to journalArticle

Goodall, R. ; Moore, J. C. ; Pécz, B. ; Grime, G. W. ; Salter, C. J. ; Grovenor, C. R M. / Fabrication of cube-textured Ag-buffered Ni substrates by electro-epitaxial deposition. In: Superconductor Science and Technology. 2001 ; Vol. 14, No. 3. pp. 124-129.
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