Fabrication and characterization of microscale heat sinks

G. Takács, György Bognár, Enikő Bándy, Gábor Rózsás, Péter G. Szabó

Research output: Contribution to journalArticle

2 Citations (Scopus)

Abstract

In the field of thermal management, engineers are well aware of the challenges posed by the increasing level of dissipation. Among the many possible solutions to counter the threat of overheating, one is dealing with the usage of microscale heat sinks, where the forced air or liquid cooling solution is integrated into the electronic package itself. As the System-on-Package integration is not a straightforward task, many fabrication steps have to be fully developed before a successful chip-level cooling system is ready to be used. In this paper, as one of these many steps, we present a refined manufacturing technology which offers the possibility to create the microscale heatsink integrated together with the electronic devices. With the refined manufacturing technology, several channel patterns can be created relatively easily. Nevertheless, only simple channel patterns with integrated diodes are presented now which are tested with an enhanced thermal characterization method developed for microchannel based cooling structures in the last years.

Original languageEnglish
Pages (from-to)480-487
Number of pages8
JournalMicroelectronics Reliability
Volume79
DOIs
Publication statusPublished - Dec 1 2017

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Keywords

  • Flow type transition
  • Integrated cooling
  • Micromachining
  • Microscale heat sink

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Atomic and Molecular Physics, and Optics
  • Condensed Matter Physics
  • Safety, Risk, Reliability and Quality
  • Surfaces, Coatings and Films
  • Electrical and Electronic Engineering

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