Extracting model parameters from thermal transient measurements for thermal stress simulation

Zoltan Sarkany, M. Rencz

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

In this article it is presented how structural information and temperature distribution can be calculated from thermal transient measurement results. We show how the temperature distribution can be approximated from a time domain temperature transient using simple calculations and that not only the temperatures but the geometry of a three dimensional model can also be calculated from the thermal RC network. The identification method is demonstrated using the measurement results of a simple package structure and the source and magnitude of uncertainties are also investigated.

Original languageEnglish
Title of host publicationTHERMINIC 2014 - 20th International Workshop on Thermal Investigations of ICs and Systems, Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Print)9781479954155
DOIs
Publication statusPublished - Dec 2 2014
Event20th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2014 - Greenwich, London, United Kingdom
Duration: Sep 24 2014Sep 26 2014

Other

Other20th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2014
CountryUnited Kingdom
CityGreenwich, London
Period9/24/149/26/14

Fingerprint

Thermal stress
Temperature distribution
Temperature
Geometry
Hot Temperature
Uncertainty

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering

Cite this

Sarkany, Z., & Rencz, M. (2014). Extracting model parameters from thermal transient measurements for thermal stress simulation. In THERMINIC 2014 - 20th International Workshop on Thermal Investigations of ICs and Systems, Proceedings [6972539] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/THERMINIC.2014.6972539

Extracting model parameters from thermal transient measurements for thermal stress simulation. / Sarkany, Zoltan; Rencz, M.

THERMINIC 2014 - 20th International Workshop on Thermal Investigations of ICs and Systems, Proceedings. Institute of Electrical and Electronics Engineers Inc., 2014. 6972539.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Sarkany, Z & Rencz, M 2014, Extracting model parameters from thermal transient measurements for thermal stress simulation. in THERMINIC 2014 - 20th International Workshop on Thermal Investigations of ICs and Systems, Proceedings., 6972539, Institute of Electrical and Electronics Engineers Inc., 20th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2014, Greenwich, London, United Kingdom, 9/24/14. https://doi.org/10.1109/THERMINIC.2014.6972539
Sarkany Z, Rencz M. Extracting model parameters from thermal transient measurements for thermal stress simulation. In THERMINIC 2014 - 20th International Workshop on Thermal Investigations of ICs and Systems, Proceedings. Institute of Electrical and Electronics Engineers Inc. 2014. 6972539 https://doi.org/10.1109/THERMINIC.2014.6972539
Sarkany, Zoltan ; Rencz, M. / Extracting model parameters from thermal transient measurements for thermal stress simulation. THERMINIC 2014 - 20th International Workshop on Thermal Investigations of ICs and Systems, Proceedings. Institute of Electrical and Electronics Engineers Inc., 2014.
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