Extending a multi-level logi-thermal simulation framework to a mixed signal thermal aware simulation environment using SystemC-AMS

Lazar Jani, A. Poppe

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

With the advance of the semiconductor technology power density and related thermal management issues became design bottlenecks. These physical limits require design engineers to make several thermal aware decisions during the design process: the earlier the better. Modern hardware description languages have extensions for simulation of mixed-signal circuits (e.g. SystemC-AMS, Verilog-AMS, VHDL-AMS) but none of these approaches support co-simulation of the effect of the foreseen thermal environment of the design with the logic behavior. A relatively new simulation paradigm called logi-thermal simulation is aimed to fill this gap in the available set of simulation tools. Our framework for co-simulation of logic and thermal behavior called LogiTherm contains generic interfaces towards usual logic and thermal simulation engines. In our present framework setup SystemC and Verilog is supported as hardware description languages and two thermal field solvers, SUNRED and 3D-ICE can be used as thermal simulation engines. In this paper we present the recent developments of the LogiTherm framework that enable logi-thermal simulation of mixed signal designs. We demonstrate the capability of our system by presenting simulation results of a test system, which contains a microprocessor and mixed signal components as well.

Original languageEnglish
Title of host publicationProceedings of the 16th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2017
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages307-313
Number of pages7
ISBN (Electronic)9781509029945
DOIs
Publication statusPublished - Jul 25 2017
Event16th IEEE InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2017 - Orlando, United States
Duration: May 30 2017Jun 2 2017

Other

Other16th IEEE InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2017
CountryUnited States
CityOrlando
Period5/30/176/2/17

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Keywords

  • Logi-thermal simulation
  • Mixed-signal
  • SystemC
  • SystemC-AMS
  • Thermal-logic co-simulation

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Surfaces and Interfaces
  • Fluid Flow and Transfer Processes
  • Electrical and Electronic Engineering

Cite this

Jani, L., & Poppe, A. (2017). Extending a multi-level logi-thermal simulation framework to a mixed signal thermal aware simulation environment using SystemC-AMS. In Proceedings of the 16th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2017 (pp. 307-313). [7992486] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ITHERM.2017.7992486