EXAMINATION OF THICK-FILMS USING MODERN SURFACE ANALYTICAL TECHNIQUES.

G. Harsányi, G. Ripka

Research output: Contribution to journalArticle

2 Citations (Scopus)

Abstract

Modern surface analytical methods/EMPA, AES, SIMS etc. were used for studying the different layers in thick-film integrated circuits. Diffusion and migration effects, surface impurity distributions and surface compositions were examined. Some of the results are presented in this paper. Electrical measurements are not discussed here; only examples of the practical use of the methods are demonstrated.

Original languageEnglish
Pages (from-to)219-223
Number of pages5
JournalElectrocomponent Science and Technology
Volume11
Issue number3
Publication statusPublished - May 1984

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Thick films
Thick film circuits
Secondary ion mass spectrometry
Surface structure
Impurities

ASJC Scopus subject areas

  • Engineering(all)

Cite this

EXAMINATION OF THICK-FILMS USING MODERN SURFACE ANALYTICAL TECHNIQUES. / Harsányi, G.; Ripka, G.

In: Electrocomponent Science and Technology, Vol. 11, No. 3, 05.1984, p. 219-223.

Research output: Contribution to journalArticle

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