Examination of Thick-Films Using Modern Surface Analytical Techniques

G. Harsányi, G. Ripka

Research output: Contribution to journalArticle

2 Citations (Scopus)

Abstract

Modern surface analytical methods/EMPA, AES, SIMS etc. were used for studying the different layers in thick-film integrated circuits. Diffusion and migration effects, surface impurity distributions and surface compositions were examined. Some of the results are presented in this paper. Electrical measurements are not discussed here; only examples of the practical use of the methods are demonstrated.

Original languageEnglish
Pages (from-to)219-223
Number of pages5
JournalElectroComponent Science and Technology
Volume11
Issue number3
DOIs
Publication statusPublished - 1984

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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