Enhanced traceability and consistency with Augmented Lifecycle Space

Jozsef Klespitz, Miklos Biro, L. Kovács

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Modern software development is unimaginable without the help of Application lifecycle management systems (ALMs) due to the heavy documentation and communication needs, especially in safety-critical developments. In this paper the idea of Augmented Lifecycle Space is presented together with its use and benefits. The main target of application is to enhance traceability and consistency throughout the development with minimal or reduced human effort. The idea can be realized easily in homogeneous ALM systems. In case of heterogeneous systems, which is the main scope of this research, some kind of interoperability is required among the used tools. Open Services for Lifecycle Collaboration (OSLC) is a possible solution and it is used to illustrate a possible setup for further studies.

Original languageEnglish
Title of host publicationINES 2016 - 20th Jubilee IEEE International Conference on Intelligent Engineering Systems, Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages207-212
Number of pages6
ISBN (Electronic)9781509012169
DOIs
Publication statusPublished - Aug 26 2016
Event20th Jubilee IEEE International Conference on Intelligent Engineering Systems, INES 2016 - Budapest, Hungary
Duration: Jun 30 2016Jul 2 2016

Other

Other20th Jubilee IEEE International Conference on Intelligent Engineering Systems, INES 2016
CountryHungary
CityBudapest
Period6/30/167/2/16

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Keywords

  • application lifecycle management
  • development process improvement
  • open services for lifecycle collaboration
  • tool integration
  • tool interoperability

ASJC Scopus subject areas

  • Artificial Intelligence
  • Control and Systems Engineering
  • Modelling and Simulation
  • Computer Science Applications
  • Numerical Analysis

Cite this

Klespitz, J., Biro, M., & Kovács, L. (2016). Enhanced traceability and consistency with Augmented Lifecycle Space. In INES 2016 - 20th Jubilee IEEE International Conference on Intelligent Engineering Systems, Proceedings (pp. 207-212). [7555121] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/INES.2016.7555121