Enhanced thermal characterization method of microscale heatsink structures

G. Takács, P. G. Szabo, Gy Bognar

Research output: Chapter in Book/Report/Conference proceedingConference contribution

7 Citations (Scopus)

Abstract

In the frame of thermal management of electronic devices, finding efficient cooling solutions of the next generation equipment is a hot topic. If a new or improved solution is presented it always requires efficient characterization methods to prove the benefits compared to its predecessor. In case of microscale heatsink structures which are integral parts of modern chip or package level cooling concepts, an efficient measurement method is needed to analyse the performance of structures with different layouts and/or manufacturing technologies. This paper presents an enhanced thermal characterization method of microchannel based cooling structures, determining relevant partial thermal resistances from structure functions obtained by thermal transient testing. Our prior microscale heatsink characterization method was recently improved, accounting e.g. for possible nonlinearities of the heat transfer processes. This paper presents how we have improved our measurements setup in detail to deal with these phenomena compared to the previous setup.

Original languageEnglish
Title of host publicationTHERMINIC 2015 - 21st International Workshop on Thermal Investigations of ICs and Systems
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781467397056
DOIs
Publication statusPublished - Jan 1 2015
Event21st International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2015 - Paris, France
Duration: Sep 30 2015Oct 2 2015

Publication series

NameTHERMINIC 2015 - 21st International Workshop on Thermal Investigations of ICs and Systems

Other

Other21st International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2015
CountryFrance
CityParis
Period9/30/1510/2/15

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ASJC Scopus subject areas

  • Fluid Flow and Transfer Processes
  • Electrical and Electronic Engineering

Cite this

Takács, G., Szabo, P. G., & Bognar, G. (2015). Enhanced thermal characterization method of microscale heatsink structures. In THERMINIC 2015 - 21st International Workshop on Thermal Investigations of ICs and Systems [7389617] (THERMINIC 2015 - 21st International Workshop on Thermal Investigations of ICs and Systems). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/THERMINIC.2015.7389617