Enhanced thermal characterization method of microscale heatsink structures

G. Takács, P. G. Szabó, Gy Bognár

Research output: Contribution to journalArticle

3 Citations (Scopus)

Abstract

In the frame of thermal management of electronic devices, finding efficient cooling solutions for next generation equipment is an emerging topic. If a new or improved solution is presented it always requires efficient characterization methods to prove the benefits compared to its predecessor. In case of microscale heatsink structures which are integral parts of modern chip or package level cooling concepts, an efficient measurement method is needed to analyse the performance of structures with different layouts and/or manufacturing technologies. This paper presents an enhanced thermal characterization method of microchannel based cooling structures, determining relevant partial thermal resistances from structure functions obtained by thermal transient testing. Our prior microscale heatsink characterization method was recently improved, accounting e.g. for possible non-idealities of the heat transfer processes. This paper presents how we have improved our measurements setup in detail to deal with these phenomena compared to the previous setup.

Original languageEnglish
Pages (from-to)21-28
Number of pages8
JournalMicroelectronics Reliability
Volume67
DOIs
Publication statusPublished - Dec 1 2016

Fingerprint

microbalances
Cooling
cooling
thermal resistance
microchannels
Microchannels
Heat resistance
layouts
emerging
manufacturing
heat transfer
chips
Heat transfer
Testing
electronics
Hot Temperature
Thermal management (electronics)

Keywords

  • Integrated cooler
  • Microchannel heat sink
  • Thermal transient testing

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Atomic and Molecular Physics, and Optics
  • Condensed Matter Physics
  • Safety, Risk, Reliability and Quality
  • Surfaces, Coatings and Films
  • Electrical and Electronic Engineering

Cite this

Enhanced thermal characterization method of microscale heatsink structures. / Takács, G.; Szabó, P. G.; Bognár, Gy.

In: Microelectronics Reliability, Vol. 67, 01.12.2016, p. 21-28.

Research output: Contribution to journalArticle

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