Electrostatic force detection during anodic wafer bonding

Research output: Chapter in Book/Report/Conference proceedingConference contribution


This paper proposes a novel in situ monitoring method for anodic wafer bonding by measuring the evolving electrostatic force between the wafers during the bonding process. The genuine principle of the developed method is based on the direct detection of the electrostatic force compressing the wafers by measuring the resultant displacement of a proper silicon membrane structure. The membrane deformation is to be determined from the capacitance change of the structure formed by the flexible silicon and the fix metal electrode. In contrast to other experimental methods not only the resulted bonding strength could be studied posterior, but the entire process by this continuous in situ measurement. The methodology could significantly facilitate the comprehension of physical phenomena of the bonding process in correlation to the parameters (temperature, voltage bias, time) and establishing optimal conditions for particular structure development.

Original languageEnglish
Title of host publicationIEEE SENSORS 2012 - Proceedings
Publication statusPublished - Dec 1 2012
Event11th IEEE SENSORS 2012 Conference - Taipei, Taiwan, Province of China
Duration: Oct 28 2012Oct 31 2012

Publication series

NameProceedings of IEEE Sensors


Other11th IEEE SENSORS 2012 Conference
CountryTaiwan, Province of China

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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