Electrochemical Processes Resulting in Migrated Short Failures in Microcircuits

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Metals can exhibit dendritic short-circuits caused by electrochemical migration in conductor-insulator structures, which may result in failures and reliability problems in microcircuits. The classical model of electrochemical migration has been well known for several decades. This process is a transport of metal ions between two metallization stripes under bias through a continuous aqueous electrolyte. Due to the electrodeposition at the cathode, dendrites and dendrite-like deposits are formed. Ultimately, such a deposit can lead to a short circuit in the device and can cause catastrophic failure. A few anomalous and newly discovered phenomena have initiated us to perform some revisions and to add supplementary models to the conventional one. A theoretical review based on practical results is given about the most important possible processes. Material design aspects are also discussed.

Original languageEnglish
Pages (from-to)602-610
Number of pages9
JournalIEEE Transactions on Components Packaging and Manufacturing Technology Part A
Issue number3
Publication statusPublished - Sep 1995


  • Electrochemical migration
  • dendritic growth
  • metallization failures
  • reliability of microcircuits

ASJC Scopus subject areas

  • Engineering(all)

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