Electrochemical migration of silver on conventional and biodegradable substrates in microelectronics

Balint Medgyes, Istvan Hajdu, Richard Berenyi, Laszlo Gal, Miklos Ruszinko, Gabor Harsanyi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

9 Citations (Scopus)

Abstract

Water drop (WD) test and a contact angle measurement method were used to investigate the electrochemical migration (ECM) behavior on different microelectronic substrates with silver conductor lines in all cases. Environment friendly substrates were also investigated in this study as possible candidates of the conventional ones. ECM is kind of short failure phenomenon, which can lead to series defect in case of operating microcircuits, when moisture appears on/in a conductor-dielectric-conductor system. The results show that the novel biodegradable substrate patterns can have a significant higher ECM risk comparing to the conventional ones. The main causes can be the different wetting behavior and the different conductor line accuracy of the technological processes.

Original languageEnglish
Title of host publicationProceedings of the 2014 37th International Spring Seminar on Electronics Technology, ISSE 2014
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages256-260
Number of pages5
ISBN (Electronic)9781479944552
DOIs
Publication statusPublished - Jan 1 2014
Event2014 37th International Spring Seminar on Electronics Technology, ISSE 2014 - Dresden, Germany
Duration: May 7 2014May 11 2014

Publication series

NameProceedings of the 2014 37th International Spring Seminar on Electronics Technology, ISSE 2014

Other

Other2014 37th International Spring Seminar on Electronics Technology, ISSE 2014
CountryGermany
CityDresden
Period5/7/145/11/14

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Safety, Risk, Reliability and Quality

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  • Cite this

    Medgyes, B., Hajdu, I., Berenyi, R., Gal, L., Ruszinko, M., & Harsanyi, G. (2014). Electrochemical migration of silver on conventional and biodegradable substrates in microelectronics. In Proceedings of the 2014 37th International Spring Seminar on Electronics Technology, ISSE 2014 (pp. 256-260). [6887604] (Proceedings of the 2014 37th International Spring Seminar on Electronics Technology, ISSE 2014). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ISSE.2014.6887604