Electrochemical migration of micro-alloyed low Ag solders in NaCl solution

Bálint Medgyes, Balázs Illés, Gábor Harsányi

Research output: Contribution to journalArticle

15 Citations (Scopus)

Abstract

The reliability investigation of lead-free solders is still a current issue. In this paper, Electrochemical Migration (ECM) behaviour of novel lead-free micro-alloyed low Ag content solders was investigated by water drop test in NaCl solution. The results were compared to commonly used lead-free and lead bearing solder alloys. It was found that some micro-alloyed solders can have as low ECM susceptibility as lead bearing ones. Xray photoelectron spectroscopy was also carried out to find the root cause of different ECM behaviour of micro-alloyed solders. The results of water drop test and X-ray photoelectron spectroscopy were in good agreement in terms of electrochemical migration susceptibility, since SAC0807 solder alloy has shown higher corrosion rate than SAC0307 and has a higher ability for ECM as well. It is concluded that some lead-free micro-alloyed low Ag content solder alloys (e.g.: SAC0807) may pose a high reliability risk in electronic devices during operation.

Original languageEnglish
Pages (from-to)49-55
Number of pages7
JournalPeriodica Polytechnica, Electrical Engineering
Volume57
Issue number2
DOIs
Publication statusPublished - 2013

Fingerprint

Soldering alloys
Bearings (structural)
Lead
Photoelectron spectroscopy
Corrosion rate
Water
X ray photoelectron spectroscopy

Keywords

  • Electrochemical migration
  • Micro-alloyed solder
  • Pitting corrosion
  • Water drop test
  • XPS

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Electrochemical migration of micro-alloyed low Ag solders in NaCl solution. / Medgyes, Bálint; Illés, Balázs; Harsányi, Gábor.

In: Periodica Polytechnica, Electrical Engineering, Vol. 57, No. 2, 2013, p. 49-55.

Research output: Contribution to journalArticle

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