Electrochemical migration investigations on Sn-Sb solder alloys using 3.5 wt% NaCl solution

Balint Medgyes, Robert Kiss, Szabolcs Szurdan, Daniel Rigler, Laszlo Gal, Richard Berenyi, G. Harsányi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

ECM (electrochemical migration) is sort of short failure mechanism that can lead to series defect in case of loaded circuits, when moisture exist on/in a conductor-dielectric-conductor system. Water drop (WD) test and scanning electron microscopy - energy disperse spectroscopy (SEM-EDS) methods were used to investigate the ECM behavior on different Sn-Sb alloys and pure Sn was the reference. The results show that all of the samples have similar ECM risk comparing to the pure Sn. However, in case of Sn95-Sb5 solder alloy antimony was found in the dendrites next to Sn content, which was dominated during the ECM processes in all cases.

Original languageEnglish
Title of host publication2017 40th International Spring Seminar on Electronics Technology, ISSE 2017
PublisherIEEE Computer Society
ISBN (Electronic)9781538605820
DOIs
Publication statusPublished - Aug 3 2017
Event40th International Spring Seminar on Electronics Technology, ISSE 2017 - Sofia, Bulgaria
Duration: May 10 2017May 14 2017

Other

Other40th International Spring Seminar on Electronics Technology, ISSE 2017
CountryBulgaria
CitySofia
Period5/10/175/14/17

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Safety, Risk, Reliability and Quality

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  • Cite this

    Medgyes, B., Kiss, R., Szurdan, S., Rigler, D., Gal, L., Berenyi, R., & Harsányi, G. (2017). Electrochemical migration investigations on Sn-Sb solder alloys using 3.5 wt% NaCl solution. In 2017 40th International Spring Seminar on Electronics Technology, ISSE 2017 [8000933] IEEE Computer Society. https://doi.org/10.1109/ISSE.2017.8000933