Electrochemical impedance spectroscopy as a prospective tool for the characterization of the intermetallic microstructure of lead free solder

Tamás Hurtony, Attila Bonyár, P. Gordon

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

In this study the possibility to apply electrochemical impedance spectroscopy as an alternative method for the characterisation of the intermetallic microstructures of Sn-3.5Ag lead free solder samples was investigated. The aim of the study is to compare the electrochemical impedance spectra of solder samples, reflowed with different heat profiles. A quenching technique was applied in order to solidify the solder samples in cylindrical crucibles. Differences in the microstructures of the solidified alloys were achieved by changing the temperature of the quenching media. The molded and cross sectioned specimens were observed using both optical microscopy and scanning electron microscopy (SEM) combined with energy dispersive spectroscopy (EDS). The microstructure of the ingots was revealed by selective electrochemical etching. The electrochemical impedance spectrum (EIS) was measured before and also after the selective etching process. The complex impedance spectra contain information regarding the characterized microstructure. Our aim is to determine quantitative parameters which are identical to the characteristics of the microstructure.

Original languageEnglish
Title of host publicationMaterials Science, Testing and Informatics VII
PublisherTrans Tech Publications Ltd
Pages333-338
Number of pages6
Volume812
ISBN (Print)9783038353898
DOIs
Publication statusPublished - 2015
Event9th Hungarian Conference on Materials Science, 2013 - Balatonkenese, Hungary
Duration: Oct 13 2013Oct 15 2013

Publication series

NameMaterials Science Forum
Volume812
ISSN (Print)02555476

Other

Other9th Hungarian Conference on Materials Science, 2013
CountryHungary
CityBalatonkenese
Period10/13/1310/15/13

Fingerprint

solders
Electrochemical impedance spectroscopy
Intermetallics
intermetallics
impedance
microstructure
Microstructure
spectroscopy
Soldering alloys
Quenching
quenching
etching
Electrochemical etching
Crucibles
ingots
crucibles
Ingots
Optical microscopy
Energy dispersive spectroscopy
Etching

Keywords

  • Electrochemical etching
  • Electrochemical impedance spectroscopy
  • Intermetallic compound
  • Solder microstructure

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanical Engineering
  • Mechanics of Materials

Cite this

Hurtony, T., Bonyár, A., & Gordon, P. (2015). Electrochemical impedance spectroscopy as a prospective tool for the characterization of the intermetallic microstructure of lead free solder. In Materials Science, Testing and Informatics VII (Vol. 812, pp. 333-338). (Materials Science Forum; Vol. 812). Trans Tech Publications Ltd. https://doi.org/10.4028/www.scientific.net/MSF.812.333

Electrochemical impedance spectroscopy as a prospective tool for the characterization of the intermetallic microstructure of lead free solder. / Hurtony, Tamás; Bonyár, Attila; Gordon, P.

Materials Science, Testing and Informatics VII. Vol. 812 Trans Tech Publications Ltd, 2015. p. 333-338 (Materials Science Forum; Vol. 812).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Hurtony, T, Bonyár, A & Gordon, P 2015, Electrochemical impedance spectroscopy as a prospective tool for the characterization of the intermetallic microstructure of lead free solder. in Materials Science, Testing and Informatics VII. vol. 812, Materials Science Forum, vol. 812, Trans Tech Publications Ltd, pp. 333-338, 9th Hungarian Conference on Materials Science, 2013, Balatonkenese, Hungary, 10/13/13. https://doi.org/10.4028/www.scientific.net/MSF.812.333
Hurtony T, Bonyár A, Gordon P. Electrochemical impedance spectroscopy as a prospective tool for the characterization of the intermetallic microstructure of lead free solder. In Materials Science, Testing and Informatics VII. Vol. 812. Trans Tech Publications Ltd. 2015. p. 333-338. (Materials Science Forum). https://doi.org/10.4028/www.scientific.net/MSF.812.333
Hurtony, Tamás ; Bonyár, Attila ; Gordon, P. / Electrochemical impedance spectroscopy as a prospective tool for the characterization of the intermetallic microstructure of lead free solder. Materials Science, Testing and Informatics VII. Vol. 812 Trans Tech Publications Ltd, 2015. pp. 333-338 (Materials Science Forum).
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