Electrochemical deposition and modification of Cu/Co-Cu multilayer

M. Uhlemann, A. Gebert, M. Herrich, A. Krause, A. Cziráki, L. Schultz

Research output: Contribution to journalArticle

35 Citations (Scopus)

Abstract

Multilayers of Cu/Co-Cu were electrodeposited from a citrate electrolyte on quartz with Au and Si substrates with a Permalloy/Cu seedlayer by means of the potentiostatic double-pulse technique simultaneously controlled by microgravimetric measurements. The influence of a superimposed magnetic field and of annealing conditions on the microstructure has been studied. When an external magnetic field is parallel-orientated toward the electrode, an increase of the Cu deposition rate was observed due to magnetohydrodynamic effects. In contrast, the deposition rate of Co decreases. Microstructural investigations have shown that both a superimposed uniform magnetic field up to 600 mT and an inhomogeneous field of an SmCo permanent magnet change the microstructure and improve the GMR effect. X-ray diffraction measurements revealed that all grains are arranged in the 〈1 1 1〉 direction in contrast to layers formed without magnetic field with only 75% of the grains having a (1 1 1) texture. Isothermal heat treatment at different temperatures increases the GMR effect corresponding to an increase of grain size with preferred (1 1 1) orientation.

Original languageEnglish
Pages (from-to)3005-3011
Number of pages7
JournalElectrochimica Acta
Volume48
Issue number20-22
DOIs
Publication statusPublished - Sep 30 2003

Fingerprint

Multilayers
Magnetic fields
Deposition rates
Microstructure
Quartz
Magnetohydrodynamics
Citric Acid
Electrolytes
Permanent magnets
Textures
Heat treatment
Annealing
X ray diffraction
Electrodes
Substrates
Temperature

Keywords

  • Cu/Co-Cu multilayer
  • ECSTM
  • Electrodeposition
  • Magnetic field effects

ASJC Scopus subject areas

  • Chemical Engineering(all)
  • Analytical Chemistry
  • Electrochemistry

Cite this

Uhlemann, M., Gebert, A., Herrich, M., Krause, A., Cziráki, A., & Schultz, L. (2003). Electrochemical deposition and modification of Cu/Co-Cu multilayer. Electrochimica Acta, 48(20-22), 3005-3011. https://doi.org/10.1016/S0013-4686(03)00366-9

Electrochemical deposition and modification of Cu/Co-Cu multilayer. / Uhlemann, M.; Gebert, A.; Herrich, M.; Krause, A.; Cziráki, A.; Schultz, L.

In: Electrochimica Acta, Vol. 48, No. 20-22, 30.09.2003, p. 3005-3011.

Research output: Contribution to journalArticle

Uhlemann, M, Gebert, A, Herrich, M, Krause, A, Cziráki, A & Schultz, L 2003, 'Electrochemical deposition and modification of Cu/Co-Cu multilayer', Electrochimica Acta, vol. 48, no. 20-22, pp. 3005-3011. https://doi.org/10.1016/S0013-4686(03)00366-9
Uhlemann, M. ; Gebert, A. ; Herrich, M. ; Krause, A. ; Cziráki, A. ; Schultz, L. / Electrochemical deposition and modification of Cu/Co-Cu multilayer. In: Electrochimica Acta. 2003 ; Vol. 48, No. 20-22. pp. 3005-3011.
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