Electro-thermal and logi-thermal simulators aimed at the temperature-aware design of complex integrated circuits

András Poppe, György Horváth, Gergely Nagy, Márta Rencz, Vladimír Székely

Research output: Chapter in Book/Report/Conference proceedingConference contribution

20 Citations (Scopus)

Abstract

With the increasing power dissipation increasing attention has been paid to the thermal issues in electronics design on system, board, package and chip level, including electrothermal simulation of even rather complex integrated circuits. Two distinct algorithmic directions can be distinguished in electro-thermal simulation: the simulator coupling and the simultaneous iteration or direct method. In our view the direct method is well suited for electro-thermal simulation of analog circuit blocks while simulator coupling can be used to implement logi-thermal simulation. In case of complex designs containing digital and analog blocks the two approaches can also be combined. Ideally thermal, electro-thermal and logithermal simulation of a circuit is performed already in the phase of conceptual design when only a rough idea exists about the final physical realization of the circuit. In any case, effect of the thermal boundary conditions of the die+package, cooling via the electrical connections to the die and the granularity of the simulation should be carefully considered.

Original languageEnglish
Title of host publication24th Annual IEEE Semiconductor Thermal Measurement and Management Symposium - Proceedings 2008, SEMI-THERM
Pages68-76
Number of pages9
DOIs
Publication statusPublished - Sep 15 2008
Event24th Annual IEEE Semiconductor Thermal Measurement and Management Symposium, SEMI-THERM 2008 - San Jose, CA, United States
Duration: Mar 16 2008Mar 20 2008

Publication series

NameAnnual IEEE Semiconductor Thermal Measurement and Management Symposium
ISSN (Print)1065-2221

Other

Other24th Annual IEEE Semiconductor Thermal Measurement and Management Symposium, SEMI-THERM 2008
CountryUnited States
CitySan Jose, CA
Period3/16/083/20/08

ASJC Scopus subject areas

  • Instrumentation
  • Electrical and Electronic Engineering

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    Poppe, A., Horváth, G., Nagy, G., Rencz, M., & Székely, V. (2008). Electro-thermal and logi-thermal simulators aimed at the temperature-aware design of complex integrated circuits. In 24th Annual IEEE Semiconductor Thermal Measurement and Management Symposium - Proceedings 2008, SEMI-THERM (pp. 68-76). [4509369] (Annual IEEE Semiconductor Thermal Measurement and Management Symposium). https://doi.org/10.1109/STHERM.2008.4509369