Electro-thermal and logi-thermal simulation of VLSI designs

Vladimir Székely, András Poppe, András Páhi, Alpár Csendes, Gábor Hajas, Márta Rencz

Research output: Contribution to journalArticle

65 Citations (Scopus)


Due to severe thermal problems of today's VLSI integrated circuits the need for reliable and quick thermal, electro-thermal and logi-thermal simulation tools is increasing. In this paper, we discuss the latest advances in the SISSI package (simulator for integrated structures by simultaneous iteration) which is a tool developed originally for analog VLSI design. The improvements include electro-thermal ac and transient simulation and the consideration of the thermal voltage of Si-Al contacts. Furthermore, we introduce a new module of SISSI, LOGITHERM, which is aimed at the self-consistent logic and thermal simulation of large digital VLSI designs. The features of our simulator package are highlighted by simulation examples that are compared in most cases with measurement results.

Original languageEnglish
Pages (from-to)258-269
Number of pages12
JournalIEEE Transactions on Very Large Scale Integration (VLSI) Systems
Issue number3
Publication statusPublished - Dec 1 1997



  • Electro-thermal simulation
  • Logi-thermal simulation
  • Thermal network extraction

ASJC Scopus subject areas

  • Software
  • Hardware and Architecture
  • Electrical and Electronic Engineering

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