Electrical resistivity and thermal properties of compatibilized multi-walled carbon nanotube/polypropylene composites

A. Szentes, Cs Varga, G. Horváth, L. Bartha, Z. Kónya, H. Haspel, J. Szél, A. Kukovecz

Research output: Contribution to journalArticle

31 Citations (Scopus)


The electrical resistivity and thermal properties of multi-walled carbon nanotube/polypropylene (MWCNT/PP) composites have been investigated in the presence of coupling agents applied for improving the compatibility between the nanotubes and the polymer. A novel olefin-maleic-anhydride copolymer and an olefin-maleic-anhydride copolymer based derivative have been used as compatibilizers to achieve better dispersion of MWCNTs in the polymer matrix. The composites have been produced by extrusion followed by injection moulding. They contained different amounts of MWCNTs (0.5, 2, 3 and 5 wt%) and coupling agent to enhance the interactions between the carbon nanotubes and the polymer. The electrical resistivity of the composites has been investigated by impedance spectroscopy, whereas their thermal properties have been determined using a thermal analyzer operating on the basis of the periodic thermal perturbation method. Rheological properties, BET-area and adsorption-desorption isotherms have been determined. Dispersion of MWCNTs in the polymer has been studied by scanning electron microscopy (SEM).

Original languageEnglish
Pages (from-to)494-502
Number of pages9
JournalExpress Polymer Letters
Issue number6
Publication statusPublished - Jun 1 2012


  • Electrical resistivity
  • Multi-walled carbon nanotubes
  • Polymer composites
  • Polypropylene
  • Thermal conductivity

ASJC Scopus subject areas

  • Chemical Engineering(all)
  • Physical and Theoretical Chemistry
  • Polymers and Plastics
  • Organic Chemistry
  • Materials Chemistry

Fingerprint Dive into the research topics of 'Electrical resistivity and thermal properties of compatibilized multi-walled carbon nanotube/polypropylene composites'. Together they form a unique fingerprint.

  • Cite this