Effects of flux residues on surface insulation resistance and electrochemical migration

Csaba Dominkovics, G. Harsányi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

16 Citations (Scopus)

Abstract

Two different types of fluxes - which are used mainly in wave soldering - were analyzed especially considering how they affect the reliability of electrical circuits. Flux residues mainly have effects on surface insulation resistance (SIR) and electrochemical migration (ECM). If we use fluxes without cleaning process after soldering, the residual organic and inorganic materials absorbed by the surface can extremely decrease the resistance between close running wires. This increases the probability of shortage and sparking. The fluxes were analyzed in freshly opened and aged state. The SIR was significantly larger when aged fluxes were used than in the case of newly opened specimens were applied. The electrochemical migration is one of the most important failure mechanisms in the field of printed wiring boards (PWB). The ECM is one of the most important physical-chemical processes, which limits the realization of fine pitch structures. We have carried out experiments on PWBs covered by different kind of no-clean fluxes in order to compare the mean time to failure of the migration process. The most important characteristics were examined by water drop tests. The experiments were executed by the aid of data acquisition device taking care of reproducibility. Test results demonstrate that the residual organic (or inorganic) materials can cause ionic induced migration and the failure rate can increase.

Original languageEnglish
Title of host publicationISSE 2006 - 29th International Spring Seminar on Electronics Technology: Nano Technologies for Electronics Packaging, Conference Proceedings
Pages206-210
Number of pages5
DOIs
Publication statusPublished - 2006
EventISSE 2006 - 29th International Spring Seminar on Electronics Technology: Nano Technologies for Electronics Packaging - St. Marienthal, Germany
Duration: May 10 2006May 14 2006

Other

OtherISSE 2006 - 29th International Spring Seminar on Electronics Technology: Nano Technologies for Electronics Packaging
CountryGermany
CitySt. Marienthal
Period5/10/065/14/06

Fingerprint

Insulation
Fluxes
Soldering
Electric sparks
Printed circuit boards
Cleaning
Data acquisition
Experiments
Wire
Networks (circuits)
Water

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Dominkovics, C., & Harsányi, G. (2006). Effects of flux residues on surface insulation resistance and electrochemical migration. In ISSE 2006 - 29th International Spring Seminar on Electronics Technology: Nano Technologies for Electronics Packaging, Conference Proceedings (pp. 206-210). [4216027] https://doi.org/10.1109/ISSE.2006.365387

Effects of flux residues on surface insulation resistance and electrochemical migration. / Dominkovics, Csaba; Harsányi, G.

ISSE 2006 - 29th International Spring Seminar on Electronics Technology: Nano Technologies for Electronics Packaging, Conference Proceedings. 2006. p. 206-210 4216027.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Dominkovics, C & Harsányi, G 2006, Effects of flux residues on surface insulation resistance and electrochemical migration. in ISSE 2006 - 29th International Spring Seminar on Electronics Technology: Nano Technologies for Electronics Packaging, Conference Proceedings., 4216027, pp. 206-210, ISSE 2006 - 29th International Spring Seminar on Electronics Technology: Nano Technologies for Electronics Packaging, St. Marienthal, Germany, 5/10/06. https://doi.org/10.1109/ISSE.2006.365387
Dominkovics C, Harsányi G. Effects of flux residues on surface insulation resistance and electrochemical migration. In ISSE 2006 - 29th International Spring Seminar on Electronics Technology: Nano Technologies for Electronics Packaging, Conference Proceedings. 2006. p. 206-210. 4216027 https://doi.org/10.1109/ISSE.2006.365387
Dominkovics, Csaba ; Harsányi, G. / Effects of flux residues on surface insulation resistance and electrochemical migration. ISSE 2006 - 29th International Spring Seminar on Electronics Technology: Nano Technologies for Electronics Packaging, Conference Proceedings. 2006. pp. 206-210
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