Effect of water condensation on electrochemical migration in case of FR4 and polyimide substrates

Bálint Medgyes, Balázs Illés, Gábor Harsányi

Research output: Contribution to journalArticle

12 Citations (Scopus)


The effect of water condensation on electrochemical migration was investigated by water drop and thermal humidity bias tests. The investigations were carried out on immersion silver surface finish on glass fiber epoxy (FR4) and polyimide (PI) substrate. During the thermal humidity bias tests, water condensation was monitored by an in situ and real time optical inspection system. Simultaneously, electrical measurements were also done in order to validate the visual results. The water drop tests (without condensation effect) have not showed any dendrite growth time difference between the substrate materials. However, in the case of the thermal humidity bias tests (with condensation effect), it was observed that the water condensation intensity is significantly related to the electrochemical migration failure mechanism. In the case of FR4 substrate the mean time to failure was observed to be lower than in case of PI which effect was caused by the different water condensation intensity which depends on the surface roughness and the thermal diffusivity of the substrate materials. Therefore, the water condensation effect has to be considered in the classical electrochemical migration model.

Original languageEnglish
Pages (from-to)2315-2321
Number of pages7
JournalJournal of Materials Science: Materials in Electronics
Issue number7
Publication statusPublished - Jul 1 2013

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Atomic and Molecular Physics, and Optics
  • Condensed Matter Physics
  • Electrical and Electronic Engineering

Fingerprint Dive into the research topics of 'Effect of water condensation on electrochemical migration in case of FR4 and polyimide substrates'. Together they form a unique fingerprint.

  • Cite this