Effect of component-level heat conduction on reflow soldering failures

Balázs Illés, Olivér Krammer, Gábor Harsányi, Zsolt Illyefalvi-Vitéz, András Szabó

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

In this paper a 3D conduction model and its possible calculation methods are presented. Our 3D model is based on the thermal (central) node theory. It means that all elements of the circuit contain a central node, to which all of the thermal mass of that area of the assembly is assigned [1]. The model can describe and compute the conduction effects and the thermal distribution during reflow soldering at the level of discrete components. Three calculation methods of the 3D conduction model (discrete calculation, half-continual calculation and continual calculation) were presented. The calculation methods were compared according to the computing time, the difficulty of the implementation and the accuracy limits. Finally a method (conduction orientation) was presented which can define the dominant direction of conduction in a system or in a part of the system. The ability of this method was also discussed.

Original languageEnglish
Title of host publicationESTC 2006 - 1st Electronics Systemintegration Technology Conference
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1386-1392
Number of pages7
ISBN (Print)1424405521, 9781424405527
DOIs
Publication statusPublished - Jan 1 2006
EventESTC 2006 - 1st Electronics Systemintegration Technology Conference - Dresden, Saxony, Germany
Duration: Sep 5 2006Sep 7 2006

Publication series

NameESTC 2006 - 1st Electronics Systemintegration Technology Conference
Volume2

Other

OtherESTC 2006 - 1st Electronics Systemintegration Technology Conference
CountryGermany
CityDresden, Saxony
Period9/5/069/7/06

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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  • Cite this

    Illés, B., Krammer, O., Harsányi, G., Illyefalvi-Vitéz, Z., & Szabó, A. (2006). Effect of component-level heat conduction on reflow soldering failures. In ESTC 2006 - 1st Electronics Systemintegration Technology Conference (pp. 1386-1392). [4060917] (ESTC 2006 - 1st Electronics Systemintegration Technology Conference; Vol. 2). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ESTC.2006.280192