Education project for the development of curricula, research and prototyping facilities in the field of electronics interconnection and packaging

Z. Illyefalvi-Vitez, G. Harsanyi, P. Nemeth, J. Pinkola

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The preparation of electronics engineers for the 21st century's requirements in the field of microelectronics interconnection and packaging is a real challenge for today's education. An approach that provides appropriate lecture courses and practical experiments, initiates students into research projects, and teaches technology in a real prototype manufacturing environment, can hopefully achieve the main goals. A project for the development of the education has been started.

Original languageEnglish
Title of host publication1998 Proceedings - 48th Electronic Components and Technology Conference, ECTC 1998
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages657-662
Number of pages6
ISBN (Print)0780345266
DOIs
Publication statusPublished - Jan 1 1998
Event48th Electronic Components and Technology Conference, ECTC 1998 - Seattle, United States
Duration: May 25 1998May 28 1998

Publication series

NameProceedings - Electronic Components and Technology Conference
VolumePart F133492
ISSN (Print)0569-5503

Conference

Conference48th Electronic Components and Technology Conference, ECTC 1998
CountryUnited States
CitySeattle
Period5/25/985/28/98

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ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

Cite this

Illyefalvi-Vitez, Z., Harsanyi, G., Nemeth, P., & Pinkola, J. (1998). Education project for the development of curricula, research and prototyping facilities in the field of electronics interconnection and packaging. In 1998 Proceedings - 48th Electronic Components and Technology Conference, ECTC 1998 (pp. 657-662). [678767] (Proceedings - Electronic Components and Technology Conference; Vol. Part F133492). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ECTC.1998.678767