Education project for the development of curricula, research and prototyping facility in the field of electronics interconnection and packaging

Zsolt Illyefalvi-Vitez, G. Harsányi, Pal Nemeth, Janos Pinkola

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The preparation of electronics engineers for the 21st century's requirements in the field of microelectronics interconnection and packaging is a real challenge for today's education. An approach that provides appropriate lecture courses and practical experiments, initiates students into research projects, and teaches technology in a real prototype manufacturing environment, can hopefully achieve the main goals. A project for the development of the education has been started.

Original languageEnglish
Title of host publicationProceedings - Electronic Components and Technology Conference
PublisherIEEE
Pages657-662
Number of pages6
Publication statusPublished - 1998
EventProceedings of the 1998 48th Electronic Components & Technology Conference - Seattle, WA, USA
Duration: May 25 1998May 28 1998

Other

OtherProceedings of the 1998 48th Electronic Components & Technology Conference
CitySeattle, WA, USA
Period5/25/985/28/98

Fingerprint

Curricula
Packaging
Electronic equipment
Education
Microelectronics
Students
Engineers
Experiments

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Illyefalvi-Vitez, Z., Harsányi, G., Nemeth, P., & Pinkola, J. (1998). Education project for the development of curricula, research and prototyping facility in the field of electronics interconnection and packaging. In Proceedings - Electronic Components and Technology Conference (pp. 657-662). IEEE.

Education project for the development of curricula, research and prototyping facility in the field of electronics interconnection and packaging. / Illyefalvi-Vitez, Zsolt; Harsányi, G.; Nemeth, Pal; Pinkola, Janos.

Proceedings - Electronic Components and Technology Conference. IEEE, 1998. p. 657-662.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Illyefalvi-Vitez, Z, Harsányi, G, Nemeth, P & Pinkola, J 1998, Education project for the development of curricula, research and prototyping facility in the field of electronics interconnection and packaging. in Proceedings - Electronic Components and Technology Conference. IEEE, pp. 657-662, Proceedings of the 1998 48th Electronic Components & Technology Conference, Seattle, WA, USA, 5/25/98.
Illyefalvi-Vitez Z, Harsányi G, Nemeth P, Pinkola J. Education project for the development of curricula, research and prototyping facility in the field of electronics interconnection and packaging. In Proceedings - Electronic Components and Technology Conference. IEEE. 1998. p. 657-662
Illyefalvi-Vitez, Zsolt ; Harsányi, G. ; Nemeth, Pal ; Pinkola, Janos. / Education project for the development of curricula, research and prototyping facility in the field of electronics interconnection and packaging. Proceedings - Electronic Components and Technology Conference. IEEE, 1998. pp. 657-662
@inproceedings{3586b4473f944bec8bd5a724b01a4556,
title = "Education project for the development of curricula, research and prototyping facility in the field of electronics interconnection and packaging",
abstract = "The preparation of electronics engineers for the 21st century's requirements in the field of microelectronics interconnection and packaging is a real challenge for today's education. An approach that provides appropriate lecture courses and practical experiments, initiates students into research projects, and teaches technology in a real prototype manufacturing environment, can hopefully achieve the main goals. A project for the development of the education has been started.",
author = "Zsolt Illyefalvi-Vitez and G. Hars{\'a}nyi and Pal Nemeth and Janos Pinkola",
year = "1998",
language = "English",
pages = "657--662",
booktitle = "Proceedings - Electronic Components and Technology Conference",
publisher = "IEEE",

}

TY - GEN

T1 - Education project for the development of curricula, research and prototyping facility in the field of electronics interconnection and packaging

AU - Illyefalvi-Vitez, Zsolt

AU - Harsányi, G.

AU - Nemeth, Pal

AU - Pinkola, Janos

PY - 1998

Y1 - 1998

N2 - The preparation of electronics engineers for the 21st century's requirements in the field of microelectronics interconnection and packaging is a real challenge for today's education. An approach that provides appropriate lecture courses and practical experiments, initiates students into research projects, and teaches technology in a real prototype manufacturing environment, can hopefully achieve the main goals. A project for the development of the education has been started.

AB - The preparation of electronics engineers for the 21st century's requirements in the field of microelectronics interconnection and packaging is a real challenge for today's education. An approach that provides appropriate lecture courses and practical experiments, initiates students into research projects, and teaches technology in a real prototype manufacturing environment, can hopefully achieve the main goals. A project for the development of the education has been started.

UR - http://www.scopus.com/inward/record.url?scp=0031625159&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0031625159&partnerID=8YFLogxK

M3 - Conference contribution

AN - SCOPUS:0031625159

SP - 657

EP - 662

BT - Proceedings - Electronic Components and Technology Conference

PB - IEEE

ER -