EBSD sample preparation: High energy Ar ion milling

Zoltán Dankházi, Szilvia Kalácska, Adrienn Baris, Gábor Varga, Zsolt Radi, Károly Havancsák

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

Surface quality development on series of metal samples was investigated using a new Ar ion milling apparatus. The surface quality of samples was characterized by the image quality (IQ) parameter of the electron backscatter diffraction (EBSD) measurement. Ar ion polishing recipes have provided to prepare a surface appropriate for high quality EBSD mapping. The initial surfaces of samples were roughly grinded and polished. High quality surface smoothness could be achieved during the subsequent Ar ion polishing treatment. The optimal angles of Ar ion incidence and the polishing times were determined for several materials.

Original languageEnglish
Title of host publicationMaterials Science, Testing and Informatics VII
EditorsTibor Berecz, Kornél Májlinger, Imre Norbert Orbulov, Péter János Szabó, Imre Norbert Orbulov
PublisherTrans Tech Publications Ltd
Pages309-314
Number of pages6
ISBN (Electronic)9783038353898
DOIs
Publication statusPublished - Jan 1 2015
Event9th Hungarian Conference on Materials Science, 2013 - Balatonkenese, Hungary
Duration: Oct 13 2013Oct 15 2013

Publication series

NameMaterials Science Forum
Volume812
ISSN (Print)0255-5476
ISSN (Electronic)1662-9752

Other

Other9th Hungarian Conference on Materials Science, 2013
CountryHungary
CityBalatonkenese
Period10/13/1310/15/13

Keywords

  • EBSD
  • Ion milling
  • SEM
  • Sample preparation

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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  • Cite this

    Dankházi, Z., Kalácska, S., Baris, A., Varga, G., Radi, Z., & Havancsák, K. (2015). EBSD sample preparation: High energy Ar ion milling. In T. Berecz, K. Májlinger, I. N. Orbulov, P. J. Szabó, & I. N. Orbulov (Eds.), Materials Science, Testing and Informatics VII (pp. 309-314). (Materials Science Forum; Vol. 812). Trans Tech Publications Ltd. https://doi.org/10.4028/www.scientific.net/MSF.812.309