Dynamic thermal multiport modeling of IC packages

Research output: Contribution to journalArticle

59 Citations (Scopus)

Abstract

The dynamic thermal behavior of electronic subsystems is characterized by their dynamic compact models. These models have to be similar to the steady state models in describing the fact that the heat is usually leaving on different locations (ports), necessitating multiport description of the thermal behavior. In our paper we present a method suitable for direct generation of multiport dynamic compact thermal models from a series of thermal transient simulations or measurements. The generated RC electrical equivalent circuit model, exercised with a network simulator program provided the same transient functions as the measured ones for various boundary conditions, proving the accuracy of the method.

Original languageEnglish
Pages (from-to)596-604
Number of pages9
JournalIEEE Transactions on Components and Packaging Technologies
Volume24
Issue number4
DOIs
Publication statusPublished - Dec 2001

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Equivalent circuits
Simulators
Hot Temperature
Boundary conditions

Keywords

  • Package modeling
  • Reduced order modeling
  • Thermal modeling

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Industrial and Manufacturing Engineering
  • Materials Science(all)

Cite this

Dynamic thermal multiport modeling of IC packages. / Rencz, M.; Székely, V.

In: IEEE Transactions on Components and Packaging Technologies, Vol. 24, No. 4, 12.2001, p. 596-604.

Research output: Contribution to journalArticle

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