Dynamic compact models of cooling mounts for fast board level design

G. Farkas, A. Poppe, E. Kollar, P. Stehouwer

Research output: Contribution to journalConference article

22 Citations (Scopus)

Abstract

Traditional board level thermal simulators provide temperature distribution on the board only. Recently developed simulators calculate exact junction temperatures obtained by the co-simulation of the detailed board model and the dynamic compact models of the devices the on board. The DELPHI project targeted the generation of steady-state compact models while the aim of the recent PROFIT project was the same for dynamic simulations. This paper tries to extend the DELPHI and PROFIT methodologies to allow completing dynamic compact models of device packages with compact models of cooling assemblies for the same purpose: co-simulation with the detailed board model. A few case studies are presented showing how such models can be constructed using structure functions and transient model fitting tools.

Original languageEnglish
Pages (from-to)255-262
Number of pages8
JournalAnnual IEEE Semiconductor Thermal Measurement and Management Symposium
Publication statusPublished - Jan 1 2003
EventNineteents Annual IEEE Semiconductor Thermal Measurement And Management Symposium - San Jose, CA, United States
Duration: Mar 11 2003Mar 13 2003

ASJC Scopus subject areas

  • Instrumentation
  • Electrical and Electronic Engineering

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