DISTRIBUTION OF Cu IN Al-Cu SANDWICH LAYER AFTER ANNEALING.

G. Pető, E. Kotai

Research output: Chapter in Book/Report/Conference proceedingChapter

Abstract

The sandwich layer was constructed of 0,5 nm Al and 4-24 nm Cu films. The distribution of the Cu was modified by an isothermal heat treatment. The profile of the Cu component was measured by Rutherford Backscattering (RBS) method with **4He** plus ion at 3 Mev energy. The diffusion process in this geometry and concentration range (0,5-10 at% Cu) consists of lattice, grain boundary and surface diffusion. This work is pertinent to microcircuit element fabrication.

Original languageEnglish
Title of host publicationAnnual Proceedings - Reliability Physics (Symposium)
PublisherSoc Fr du Vide, (Suppl Vide, les Couches Minces n 201)
Pages177-180
Number of pages4
Volume1
Publication statusPublished - 1980
EventUnknown conference - Cannes, Fr
Duration: Sep 22 1980Sep 26 1980

Other

OtherUnknown conference
CityCannes, Fr
Period9/22/809/26/80

Fingerprint

Surface diffusion
Rutherford backscattering spectroscopy
Crystal lattices
Grain boundaries
Heat treatment
Annealing
Fabrication
Geometry
Ions

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Safety, Risk, Reliability and Quality

Cite this

Pető, G., & Kotai, E. (1980). DISTRIBUTION OF Cu IN Al-Cu SANDWICH LAYER AFTER ANNEALING. In Annual Proceedings - Reliability Physics (Symposium) (Vol. 1, pp. 177-180). Soc Fr du Vide, (Suppl Vide, les Couches Minces n 201).

DISTRIBUTION OF Cu IN Al-Cu SANDWICH LAYER AFTER ANNEALING. / Pető, G.; Kotai, E.

Annual Proceedings - Reliability Physics (Symposium). Vol. 1 Soc Fr du Vide, (Suppl Vide, les Couches Minces n 201), 1980. p. 177-180.

Research output: Chapter in Book/Report/Conference proceedingChapter

Pető, G & Kotai, E 1980, DISTRIBUTION OF Cu IN Al-Cu SANDWICH LAYER AFTER ANNEALING. in Annual Proceedings - Reliability Physics (Symposium). vol. 1, Soc Fr du Vide, (Suppl Vide, les Couches Minces n 201), pp. 177-180, Unknown conference, Cannes, Fr, 9/22/80.
Pető G, Kotai E. DISTRIBUTION OF Cu IN Al-Cu SANDWICH LAYER AFTER ANNEALING. In Annual Proceedings - Reliability Physics (Symposium). Vol. 1. Soc Fr du Vide, (Suppl Vide, les Couches Minces n 201). 1980. p. 177-180
Pető, G. ; Kotai, E. / DISTRIBUTION OF Cu IN Al-Cu SANDWICH LAYER AFTER ANNEALING. Annual Proceedings - Reliability Physics (Symposium). Vol. 1 Soc Fr du Vide, (Suppl Vide, les Couches Minces n 201), 1980. pp. 177-180
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