Digital processor array implementation aspects of a 3D multi-layer vision architecture

Peter Földesy, Ricardo Carmona-Galan, Ákos Zarándy, Csaba Rekeczky, Angel Rodríguez-Vázquez, Tamás Roska

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

Abstract

Technological aspects of the 3D integration of a multi-layer combined mixed-signal and digital sensor-processor array chip is described. The 3D integration raises the question of signal routing, power distribution, and heat dissipation, which aspects are considered systematically in the digital processor array layer as part of the multi layer structure. We have developed a linear programming based evaluation system to identify the proper architecture and its parameters.

Original languageEnglish
Title of host publication2010 12th International Workshop on Cellular Nanoscale Networks and their Applications, CNNA 2010
Publication statusPublished - May 21 2010
Event2010 12th International Workshop on Cellular Nanoscale Networks and their Applications, CNNA 2010 - Berkeley, CA, United States
Duration: Feb 3 2010Feb 5 2010

Publication series

Name2010 12th International Workshop on Cellular Nanoscale Networks and their Applications, CNNA 2010

Other

Other2010 12th International Workshop on Cellular Nanoscale Networks and their Applications, CNNA 2010
CountryUnited States
CityBerkeley, CA
Period2/3/102/5/10

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Keywords

  • 3D integration
  • Sensor-processor
  • UAV navigation

ASJC Scopus subject areas

  • Computer Networks and Communications
  • Electrical and Electronic Engineering

Cite this

Földesy, P., Carmona-Galan, R., Zarándy, Á., Rekeczky, C., Rodríguez-Vázquez, A., & Roska, T. (2010). Digital processor array implementation aspects of a 3D multi-layer vision architecture. In 2010 12th International Workshop on Cellular Nanoscale Networks and their Applications, CNNA 2010 [5430274] (2010 12th International Workshop on Cellular Nanoscale Networks and their Applications, CNNA 2010).