Die attach quality testing by fully contact-less measurement method

György Bognár, Gyula Horváth, Zoltán Sz̈ucs, Vladimír Székely

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The paper presents a novel, fully contact-less method for detecting die attach problems of semiconductor devices by measuring the dilatation resulting from thermal expansion. Laser interferometer measuring system was used to measure the thermal dilatation caused by infrared radiation directed onto the measured structure. By using the contact based stylus measurement method the previously got results have been cross-verified.

Original languageEnglish
Title of host publication2006 IEEE Design and Diagnostics of Electronic Circuits and systems
Pages79-80
Number of pages2
DOIs
Publication statusPublished - Dec 1 2006
Event2006 IEEE Design and Diagnostics of Electronic Circuits and systems - Praque, Czech Republic
Duration: Apr 18 2006Apr 21 2006

Publication series

Name2006 IEEE Design and Diagnostics of Electronic Circuits and systems
Volume2006

Other

Other2006 IEEE Design and Diagnostics of Electronic Circuits and systems
CountryCzech Republic
CityPraque
Period4/18/064/21/06

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Keywords

  • Heterodyne laser interferometry
  • MEMS characterization
  • Package void detection
  • Stylus method
  • Thermal dilatation

ASJC Scopus subject areas

  • Engineering(all)

Cite this

Bognár, G., Horváth, G., Sz̈ucs, Z., & Székely, V. (2006). Die attach quality testing by fully contact-less measurement method. In 2006 IEEE Design and Diagnostics of Electronic Circuits and systems (pp. 79-80). [1649578] (2006 IEEE Design and Diagnostics of Electronic Circuits and systems; Vol. 2006). https://doi.org/10.1109/DDECS.2006.1649578