Development of texture and morphology in Cu-Ag thin nanocomposite films on Si

Research output: Contribution to journalArticle

Abstract

Cu-Ag films were deposited in vacuum of 10-5-10-6 mbar onto freshly cleaned Si wafers. The composition of the films corresponded to Cu, Cu9Ag1, Cu4Ag6 and Ag. The films were investigated by X-ray diffraction and pole figures of and directions were recorded. TEM and XTEM were used to determine the morphological properties of the films. We found that Ag modifies the interaction of Cu with the Si substrate. Low amounts of Ag are enhancing the formation of the biaxial texture of Cu. Larger amounts of Ag result in the formation of wire texture of both Ag and Cu components.

Original languageEnglish
Article number082008
JournalJournal of Physics: Conference Series
Volume100
Issue numberPART 8
DOIs
Publication statusPublished - Mar 1 2008

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nanocomposites
textures
poles
wafers
wire
vacuum
transmission electron microscopy
diffraction
x rays
interactions

ASJC Scopus subject areas

  • Physics and Astronomy(all)

Cite this

Development of texture and morphology in Cu-Ag thin nanocomposite films on Si. / Misják, F.; Horváth, Z.; Barna, P.; Radnóczi, G.

In: Journal of Physics: Conference Series, Vol. 100, No. PART 8, 082008, 01.03.2008.

Research output: Contribution to journalArticle

@article{d79070c0120c4e668c109f3f1ea63da1,
title = "Development of texture and morphology in Cu-Ag thin nanocomposite films on Si",
abstract = "Cu-Ag films were deposited in vacuum of 10-5-10-6 mbar onto freshly cleaned Si wafers. The composition of the films corresponded to Cu, Cu9Ag1, Cu4Ag6 and Ag. The films were investigated by X-ray diffraction and pole figures of and directions were recorded. TEM and XTEM were used to determine the morphological properties of the films. We found that Ag modifies the interaction of Cu with the Si substrate. Low amounts of Ag are enhancing the formation of the biaxial texture of Cu. Larger amounts of Ag result in the formation of wire texture of both Ag and Cu components.",
author = "F. Misj{\'a}k and Z. Horv{\'a}th and P. Barna and G. Radn{\'o}czi",
year = "2008",
month = "3",
day = "1",
doi = "10.1088/1742-6596/100/8/082008",
language = "English",
volume = "100",
journal = "Journal of Physics: Conference Series",
issn = "1742-6588",
publisher = "IOP Publishing Ltd.",
number = "PART 8",

}

TY - JOUR

T1 - Development of texture and morphology in Cu-Ag thin nanocomposite films on Si

AU - Misják, F.

AU - Horváth, Z.

AU - Barna, P.

AU - Radnóczi, G.

PY - 2008/3/1

Y1 - 2008/3/1

N2 - Cu-Ag films were deposited in vacuum of 10-5-10-6 mbar onto freshly cleaned Si wafers. The composition of the films corresponded to Cu, Cu9Ag1, Cu4Ag6 and Ag. The films were investigated by X-ray diffraction and pole figures of and directions were recorded. TEM and XTEM were used to determine the morphological properties of the films. We found that Ag modifies the interaction of Cu with the Si substrate. Low amounts of Ag are enhancing the formation of the biaxial texture of Cu. Larger amounts of Ag result in the formation of wire texture of both Ag and Cu components.

AB - Cu-Ag films were deposited in vacuum of 10-5-10-6 mbar onto freshly cleaned Si wafers. The composition of the films corresponded to Cu, Cu9Ag1, Cu4Ag6 and Ag. The films were investigated by X-ray diffraction and pole figures of and directions were recorded. TEM and XTEM were used to determine the morphological properties of the films. We found that Ag modifies the interaction of Cu with the Si substrate. Low amounts of Ag are enhancing the formation of the biaxial texture of Cu. Larger amounts of Ag result in the formation of wire texture of both Ag and Cu components.

UR - http://www.scopus.com/inward/record.url?scp=77954336702&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=77954336702&partnerID=8YFLogxK

U2 - 10.1088/1742-6596/100/8/082008

DO - 10.1088/1742-6596/100/8/082008

M3 - Article

AN - SCOPUS:77954336702

VL - 100

JO - Journal of Physics: Conference Series

JF - Journal of Physics: Conference Series

SN - 1742-6588

IS - PART 8

M1 - 082008

ER -