Determining whiskering properties of tin-copper alloy solder-dipped platings

Barbara Horváth, Balázs Illés, Tadashi Shinohara, G. Harsányi

Research output: Contribution to journalArticle

Abstract

This paper reports the effect of humidity on whisker formation in pure tin and tin-copper alloy platings. Samples with copper substrates were plated with 10 μm pure tin or tin-copper alloys (with up to 5% Cu content). The samples were stored in high humidity (105 C/100% RH) for over 2000 hours to examine the effect of humidity in whisker growth on different tin-copper alloys. Results indicate differences in whisker growth depending on the copper content. The series of tests show the significance of humidity and melting temperature of the plating alloy for whisker formation.

Original languageEnglish
Pages (from-to)107-110
Number of pages4
JournalPeriodica Polytechnica, Electrical Engineering
Volume54
Issue number3-4
DOIs
Publication statusPublished - 2010

Fingerprint

Tin alloys
Copper alloys
Plating
Soldering alloys
Atmospheric humidity
Tin
Copper
Melting point
Substrates

Keywords

  • SEM
  • Surface finishes
  • Tin whisker

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Determining whiskering properties of tin-copper alloy solder-dipped platings. / Horváth, Barbara; Illés, Balázs; Shinohara, Tadashi; Harsányi, G.

In: Periodica Polytechnica, Electrical Engineering, Vol. 54, No. 3-4, 2010, p. 107-110.

Research output: Contribution to journalArticle

Horváth, Barbara ; Illés, Balázs ; Shinohara, Tadashi ; Harsányi, G. / Determining whiskering properties of tin-copper alloy solder-dipped platings. In: Periodica Polytechnica, Electrical Engineering. 2010 ; Vol. 54, No. 3-4. pp. 107-110.
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