Determination of the severity of thermal stress using model data calculated from thermal transient results

Zoltan Sarkany, M. Rencz

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

In this article a method is presented for the calculation of structural and thermal parameters from thermal transient measurement results in order to be used as input data for thermal stress simulation. It is shown how the geometry of the internal structure of the package and the temperature distribution can be approximated from the thermal response function measured after switching on a heating element in the package.

Original languageEnglish
Title of host publicationDTIP 2014 - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Print)9782355000287
DOIs
Publication statusPublished - Mar 9 2014
Event2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2014 - Cannes, France
Duration: Apr 2 2014Apr 4 2014

Other

Other2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2014
CountryFrance
CityCannes
Period4/2/144/4/14

Fingerprint

Thermal stress
Electric heating elements
Temperature distribution
Geometry
Hot Temperature

Keywords

  • structure function
  • temperature distribution
  • thermal stress
  • Thermal transient measurement

ASJC Scopus subject areas

  • Computer Graphics and Computer-Aided Design
  • Computer Science Applications
  • Hardware and Architecture

Cite this

Sarkany, Z., & Rencz, M. (2014). Determination of the severity of thermal stress using model data calculated from thermal transient results. In DTIP 2014 - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS [7056701] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/DTIP.2014.7056701

Determination of the severity of thermal stress using model data calculated from thermal transient results. / Sarkany, Zoltan; Rencz, M.

DTIP 2014 - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS. Institute of Electrical and Electronics Engineers Inc., 2014. 7056701.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Sarkany, Z & Rencz, M 2014, Determination of the severity of thermal stress using model data calculated from thermal transient results. in DTIP 2014 - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS., 7056701, Institute of Electrical and Electronics Engineers Inc., 2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2014, Cannes, France, 4/2/14. https://doi.org/10.1109/DTIP.2014.7056701
Sarkany Z, Rencz M. Determination of the severity of thermal stress using model data calculated from thermal transient results. In DTIP 2014 - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS. Institute of Electrical and Electronics Engineers Inc. 2014. 7056701 https://doi.org/10.1109/DTIP.2014.7056701
Sarkany, Zoltan ; Rencz, M. / Determination of the severity of thermal stress using model data calculated from thermal transient results. DTIP 2014 - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS. Institute of Electrical and Electronics Engineers Inc., 2014.
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