Determination of the severity of thermal stress using model data calculated from thermal transient results

Zoltan Sarkany, Marta Rencz

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

In this article a method is presented for the calculation of structural and thermal parameters from thermal transient measurement results in order to be used as input data for thermal stress simulation. It is shown how the geometry of the internal structure of the package and the temperature distribution can be approximated from the thermal response function measured after switching on a heating element in the package.

Original languageEnglish
Title of host publicationDTIP 2014 - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9782355000287
DOIs
Publication statusPublished - Mar 9 2014
Event2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2014 - Cannes, France
Duration: Apr 2 2014Apr 4 2014

Publication series

NameDTIP 2014 - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS

Other

Other2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2014
CountryFrance
CityCannes
Period4/2/144/4/14

Keywords

  • Thermal transient measurement
  • structure function
  • temperature distribution
  • thermal stress

ASJC Scopus subject areas

  • Computer Graphics and Computer-Aided Design
  • Computer Science Applications
  • Hardware and Architecture

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  • Cite this

    Sarkany, Z., & Rencz, M. (2014). Determination of the severity of thermal stress using model data calculated from thermal transient results. In DTIP 2014 - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS [7056701] (DTIP 2014 - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/DTIP.2014.7056701