Design of a static TIM tester

V. Székely, G. Somlay, P. G. Szabó, M. Rencz

Research output: Chapter in Book/Report/Conference proceedingConference contribution

7 Citations (Scopus)

Abstract

Nowadays the quality of thermal interface materials (TIM) has a growing importance as the increasing dissipation level of ICs requires more and more sophisticated solutions to reduce the Rth along the heat-flow path. The recent approach of TIM manufacturers is to use nanoparticles as fillings in TIM materials, in order to enhance considerably the TIM thermal conductivity. On the other hand this solution raises difficulties in the characterization of these materials. Namely, the resolution of the conventional methods is not high enough to measure resistance values as low as 0.01-0.05 Kcm2/W. This is the reason why we developed static TIM tester equipment using some new concepts. The main idea behind our design is to use the capabilities of microelectronics in order to make small sized sensors both for temperature and heat flux sensing. This way it is possible to place these sensors in the closest proximity of the measured sample. The status of this work is presented in the paper.

Original languageEnglish
Title of host publication14th International Workshop on Thermal Investigation of ICs and Systems, THERMINIC 2008
Pages132-136
Number of pages5
DOIs
Publication statusPublished - Dec 22 2008
Event14th International Workshop on THERMal INvestigation of ICs and Systems, THERMINIC 2008 - Rome, Italy
Duration: Sep 24 2008Sep 26 2008

Publication series

Name14th International Workshop on THERMal INvestigation of ICs and Systems, THERMINIC 2008

Other

Other14th International Workshop on THERMal INvestigation of ICs and Systems, THERMINIC 2008
CountryItaly
CityRome
Period9/24/089/26/08

ASJC Scopus subject areas

  • Hardware and Architecture
  • Control and Systems Engineering
  • Electrical and Electronic Engineering

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    Székely, V., Somlay, G., Szabó, P. G., & Rencz, M. (2008). Design of a static TIM tester. In 14th International Workshop on Thermal Investigation of ICs and Systems, THERMINIC 2008 (pp. 132-136). [4669894] (14th International Workshop on THERMal INvestigation of ICs and Systems, THERMINIC 2008). https://doi.org/10.1109/THERMINIC.2008.4669894