Design considerations to enhance thermal testability

Zoltan Sarkany, M. Rencz

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

With the increasing power density generated in integrated circuits, the role of thermal properties also has to be raised in the design phase. Thermal transient testing is a commonly used standard method to characterize the thermal behavior of the manufactured devices. In this paper we present the notion of DfTTT, Design for Thermal Transient Testability, an extension to the idea of 'Design for Thermal Testability' to transient measurements. We define the key requirements for the thermal transient measurements and show how small changes at schematic and packaging level can increase the ease of testing and the accuracy of results. Finally we present some examples of application.

Original languageEnglish
Title of host publicationProceedings of the 2012 IEEE 14th Electronics Packaging Technology Conference, EPTC 2012
Pages148-152
Number of pages5
DOIs
Publication statusPublished - 2012
Event2012 IEEE 14th Electronics Packaging Technology Conference, EPTC 2012 - Singapore, Singapore
Duration: Dec 5 2012Dec 7 2012

Other

Other2012 IEEE 14th Electronics Packaging Technology Conference, EPTC 2012
CountrySingapore
CitySingapore
Period12/5/1212/7/12

Fingerprint

Schematic diagrams
Testing
Integrated circuits
Packaging
Thermodynamic properties
Hot Temperature

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials

Cite this

Sarkany, Z., & Rencz, M. (2012). Design considerations to enhance thermal testability. In Proceedings of the 2012 IEEE 14th Electronics Packaging Technology Conference, EPTC 2012 (pp. 148-152). [6507068] https://doi.org/10.1109/EPTC.2012.6507068

Design considerations to enhance thermal testability. / Sarkany, Zoltan; Rencz, M.

Proceedings of the 2012 IEEE 14th Electronics Packaging Technology Conference, EPTC 2012. 2012. p. 148-152 6507068.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Sarkany, Z & Rencz, M 2012, Design considerations to enhance thermal testability. in Proceedings of the 2012 IEEE 14th Electronics Packaging Technology Conference, EPTC 2012., 6507068, pp. 148-152, 2012 IEEE 14th Electronics Packaging Technology Conference, EPTC 2012, Singapore, Singapore, 12/5/12. https://doi.org/10.1109/EPTC.2012.6507068
Sarkany Z, Rencz M. Design considerations to enhance thermal testability. In Proceedings of the 2012 IEEE 14th Electronics Packaging Technology Conference, EPTC 2012. 2012. p. 148-152. 6507068 https://doi.org/10.1109/EPTC.2012.6507068
Sarkany, Zoltan ; Rencz, M. / Design considerations to enhance thermal testability. Proceedings of the 2012 IEEE 14th Electronics Packaging Technology Conference, EPTC 2012. 2012. pp. 148-152
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