Dendritic Growth from Dielectric Constituents in Thick Film ICs

Research output: Contribution to journalArticle

Abstract

Silver and other metals can exhibit dendritic short-circuit growth caused by electrochemical migration in conductor-insulator structures. Detailed analysis of migration-free thick film Systems using migration-free conductors has demonstrated that not only metalüc components, but also dielectric constituent materials can contribute to the formation of migrated shorts after a chemical reduction process.

Original languageEnglish
Pages (from-to)54-59
Number of pages6
JournalMicroelectronics International
Volume9
Issue number1
DOIs
Publication statusPublished - 1992

Fingerprint

Silver
Thick films
Short circuit currents
thick films
Metals
conductors
short circuits
silver
insulators
metals

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Atomic and Molecular Physics, and Optics
  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Surfaces, Coatings and Films

Cite this

Dendritic Growth from Dielectric Constituents in Thick Film ICs. / Harsányi, G.

In: Microelectronics International, Vol. 9, No. 1, 1992, p. 54-59.

Research output: Contribution to journalArticle

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